HAMMARLUND FM-1

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SERIES 
EQUIVALENT 


4 Rout 
1+ (Rout / Xp)” 


Rout 
Xs= Rs (4 ) 


x 
Parallel and series equivalent 
¢ Lg formulas used for conversion. 


llector of Qi and the 5-ohm base 
he shortcoming of this technique 
be lac! of selectivity between stages, but 
vantage is in the broadband charac- 
the coupling system. The phasing 
he diagram near T1 and T2 indi- 
rrect electrical relationship of the 


three networks shown in Figs 15, 16 
will provide practical solutions to 


is assumed that the output 
ace being matched is lower than the 


the case, the network (the cirenit 
tween the points marked A and 
‘be turned around to provide the 
transformation. 
ly, the output impedance of a 
is given as a resistance in parallel 
capacitance, Coy. To use the design 
ons for these three networks, the out- 
dance must first be converted from 
el form (Roy; and C,,;) to the 
alent series form (R, and C,). These 
lent circuits and the equations for 
n are given in Fig 18. Often the 
‘capacitance is small enough that it 
neglected; the resulting error is 
ated for by using variable 
nents in the network. 
#¢ low-pass T network (Fig 17) has the 
‘ of matching a wide range of 
nces with practical component 
Some designers feel that of the 
etworks used in solid-state work, 
work is best in terms of collector 
. The harmonic suppression 
ed by the T network varies with the 
ymation ratio and the total Q of the 
fork. For stages feeding an antenna, 
onal harmonic suppression will nor- 
ye needed. This is also true for net- 
i | and 2. These three networks are 
ed in detail in Motorola Application 
WAN-267. Another excellent paper on 
a was written by Becciolini, 
la Application Note AN-721. 
ke equations for networks 1, 2 and 3 
taken from AN-267. That paper con- 


ere 


ge eee ee 


RFC1, RFC2 = 4Za1 (1.5uH) 


NETWORK 3 
DESIGN EXAMPLE 


Voz «144 
Ror * = = ee = 720 
2P, 20 
1 
X= ————_——__—_________ = 4547 
out = (2x x 3.5 x 10° x 100 x 10-14) 
R te 
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1 1 
DOSS Cerys: Se op Pere ARPS Lm Sada 


Fig 19 — A practical example of network no. 3 and the solution to the network design. 


tains computer solutions to these networks 
and others, with tabular information for 
various values of Q and source impedances. 
A fixed load value of 50 ohms is the base 
for the tabular data. 

A design example for network 3 is given 
in Fig 19. The solutions for the other two 
networks follow the same general trend, so 
examples for networks 1 and 2 will not be 
given. In Fig 19 the component ‘‘C,,,’’ is 
taken from the manufacturer’s data sheet. 
If it is not available, it can be ignored at 
the expense of a slight mathematical error 
in the network determination. By making 
Cl variable the network can be made to 
approximate the correct transformation 


ratio. At the lower frequencies C1 will be 
fairly large in value. This may require a 
fixed-value silver-mica capacitor in parallel 
with a mica compression trimmer to obtain 
the exact value of capacitance needed. The 
equations will seldom yield standard values 
of capacitance. 

L1 and L2 of Fig 19 can be wound on 
powdered-iron toroid cores of suitable 
cross-sectional area for the power involved. 
This is explained in an earlier chapter of 
this book. L1 and L2 should be separated 
by mounting them apart and at right 
angles. Alternatively, a shield can be used 
between the inductors. This will prevent 
unwanted capacitive and inductive coupling 


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Application Note 


FM MODULATION CAPABILITIES OF 
EPICAP VVC’S 


Prepared by 
Dick Schell 


Microwave Devices Group 


The author shows by empirical 
methods that the frequency vs. volt- 
age curve for Epicap voltage vari- 
able capacitors is linear for small 
(sufficient for most FM modulator 
applications) voltage variations. 

A rigorous mathematical explana- 
tion of this linear inter-dependence 
follows the empirical demonstration. 


MOTOROLA Semiconductor Products Inc. 


INTRODUCTION 


In most applications FM modulation is accomplished 
by one of three methods. A mechanical modulator using 
a capacitor microphone is the simplest system, but is 
seldom used, The capacitor microphone, being a delicate 
mechanical device, must be handled carefully. Also, it 
lacks wide capacity-variation capabilities restricting its 
application greatly. Finally, it requires a pressure wave 
input, and, consequently, is not suitable for telemetry 
applications. 


A second system employs a tube whose reactance varies 
with the modulation signal, and thereby varies the fre- 
quency of the oscillator stage used to generate the RF 
signal, This system has been quite popular, and, in the 
appropriate environment, functions quite well. As with 
other electron tube devices it is relatively large; it is 
easily breakable; and it requires filament power as well 
as a high-voltage supply. 


A third system, usually called the 'phase-angle modu- 
lation system"' employs a combining network to alter the 
instantaneous frequency of the RF energy already gen- 
erated by the oscillator stage, Combining networks usually 
use triodes, although transistors may be used also, Until 
only recently, transistors have not been used intensively 
in these applications, due to their power-handling limi- 
tations at high frequencies, Naturally, the triodes suffer 
from the same limitations as does the reactance tube. 


Many modern RF systems, particulary those used in 
the military and aerospace fields, are subjected to envi- 
ronmental stresses which are extremely severe. Solid- 
state devices with their built-in strength are in general 
superior to the mechanical and electron tube devices 
mentioned in the preceding paragraph for these applica- 
tions. Some of these applications also require high minia- 
turization can only be achieved with solid-state devices. 


RFC 10 pH 


MPS6511 


FIGURE 1 


Let us consider the desirability of using voltage variable 
capacitance diodes (VVC) as the variable elementfor FM 
modulator applications. Many people mistakenly believe 
that the nonlinear relationship between the voltage across 
a VVC and its capacity precludes its use in FM modula- 
tion applications. In this paper it will be shown that the 
Motorola EPICAPTMyvc capacity vs. voltage curve 
varies as (approximately) the inverse 1/2 power and 
that for most FM modulation applications, this capacity/ 
voltage variation is sufficiently linear for good results. 


In order to demonstrate thefeasibility of Epicap VVC's 
for FM modulator applications, the author employs an 
oscillator circuit, similar to many actual FM modulators, 
to determine the actual oscillator frequency variationfor 
a given diode voltage variation, From the results of this 
test it will be shown that over a typical FM bandwidth of 
150 kHz Epicap VVCs are suitable for FM modulation 
applications, 


Following the discussion of the bench test, a derivation 
of the expected theoretical capabilities of the Epicap VVC 
(for FM modulator applications) is presented. In con- 
clusion it is shown that the theoretical relationship and 
the experimental data obtained from the test oscillator 
are in good agreement. 


THE BENCH TEST 


Before proceeding with a description of the oscillator 
circuit it should be pointed out that the reader wishing 
more information on Epicap VVS's should consult appen- 
dix A of this paper. If additional applications information 
on VVC's or complete data sheets are desired they may 
be obtained by writing to Motorola Semiconductor Pro- 
ducts Inc., Technical Information Center, Phoenix, Ari- 
zona 85001 (P.O. Box 955). + 


The oscillator circuit, illustrated in Figure 1, employs 
a Motorola MPS6511 transistor, designed especially for 


ee 


Ls 5-1/2 TURNS 
#22 WIRE 
1/2":DiA. 


4-30 pF 
O 
Lo 7-1/2 TURNS 
#22 WIRE 
1/2 DIA; 


Circuit diagrams are included as a means of illustrating typical semiconductor applications, consequently, complete in- 


formation sufficient for construction purposes, is not necessarily given. 


been carefully checked, and is believed to be entirely reliable. 
Furthermore, such information does not convey to the purchaser of the semiconductor devices described any license un- 


der the patent rights of Motorola Inc. or others. 


The information in this application note has 
However, no responsibility is assumed for inaccuracies. 


al) 


oscillator applications. The oscillator frequency is 52 
MHz. The Epicap VVC chosen for this test circuit is the 
Motorola MV1876, a silicon epitaxial passivated diode, 
rated at 33 pF for a reverse bias voltage of -4 volts. 


Referring to the schematic, Figure 1, Ly and Cg are 
used to tune out unwanted harmonics; their combined 
effect approaches a short circuit at the frequency of os- 
cillation, The 6.8 wH RFC and the 24 pF capacitor in the 
input circuit are used to isolate the externalinput circuit 
from the RF circuit of the oscillator. At audio frequencies, 
however, there is little attenuation from these devices; 
thus, the input voltage is applied between ground and the 
positive side of the voltage-variable-capacitor. 


Circuit operation was limited to voltage inputs of +200 
mV or less, with the frequency deviations onthe order of 
+60 kHz or less. Referring to Figure 2,a plot of oscilla- 
tor frequency vs, input voltage, it can be seen that rela- 
tively good linearity can be obtained to at least +75 kHz 
making the Epical VVC applicable for commercial FM 
use (commercial FM is limitedto a deviation of +75 kHz). 
Using a frequency doubler in conjunction with the FM 
modulator would give good linearity with an allowable 
frequency deviation of +120 kHz, and a center frequency 
of 104 MHz. 


THEORETICAL ANALYSIS OF EPICAP VVC 
PERFORMANCE IN OSCILLATOR CIRCUIT 


In this section we shall analyze the Epicap VVC per- 
formance in the test circuit. In order to do this we shall 
derive Aw= f{(AV), and show that for small AV's, 

V. Many of the equations used in this section are 
derived in Appendix B; the reader should refer to that 
Appendix for the details. 


Let the value of the input voltage be represented by AV. 
The input voltage is the amount by whichthe reverse bias 
voltage under audio frequency modulation deviates from 
its quiescent value under no signal conditions. 


The polarity of AV is chosen such that a positive AV 
corresponds to an increase in the VVC reverse bias volt- 
age. With reference to Figure 1, it can be seen that the 
quiescent value of V, that is, when AV = 0, is 15 volts. 
Consequently, the reverse bias voltage across the VVC 
at any given time may be given by 15 + AV, where AV 
can be either positive, negative, or zero. 


RANGE OF LINEAR OPERATION 


The diode capacitance Cp is given by the equation* 


where Cp = total diode capacitance 
V =reverse bias voltage across the diode 
Vj and V9 are two values of the voltage about the 
quiescent value, and Cp , and Cpg are their cor- 
responding diode capacitances. 


InC../ Inc Pit 9 
D2 D1 \ 2. Cag PS CNL. 
aS ITE os Si le (1) 
In (V/V) hey Va- by Vi 


Clearly, a variation in Cp results in a change in the 
frequency of oscillation. In order to derive Aw=f (AV), 
we first derive Aw=f(AC)), then ACp =f (AV). By 
combining the latter two results we naturally arrive at 
the first result. The derivation of Aw=f ( ACp), given 
in Appendix B, results in the expression: 


w, (Kg - Ky) 
ING 


MoS SS 
2w (K, + Cp) D 


where Ore. Kg and K7 are constants determined by the 
circuit parameters defined in Appendix B. 


Since these derivations are carried out in detail in the 
Appendix B they need not be repeated here, however, it 
is instructive to examine which approximations have been 
made in the derivation, and, consequently, limit the ac- 
curacy of the result. In the Appendix we start with the 
relation: 


*Refer to Appendix A 


EXPERIMENTAL 


THEORETICAL CURVE 


CURVE 


AV( VOLTS) 


0.4 0.5 


Hz 
THEORETICAL SLOPE = 323 Sali 
m 


Hz 


EXPERIMENTAL SLOPE = 310 mV 
m 


FIGURE 2 — COMPARISON OF THEORETICAL AND EXPERIMENTAL RESULTS 


In order to obtain Aw=f ( ACp) from the above result 
several assumptions are necessary. Let w be the fre- 
quency of oscillation corresponding to a voltage-variable 
Capacitor capacitance Cp, and w+ Aw correspond to the 
VVC capacitance Cp - ACp, In the derivation itis neces- 
sary that (Aw)2 be small compared to (2 Aw)w. Since w is 
52.0 MHz, and for linear operation the maximum Aw is 
only about 60 kHz, it can be seen that this is a good as- 
sumption. Also, it is assumed that the denominator Cp - 
ACp ® Cp this is a good assumption provided the quies- 
cent value of V and the smallinput voltages lead to small 
variations in capacitance, 


The expression giving ACp =f (AV), equation 9 in 
Appendix B is: 


Cho [av] 
AC. =———_ (2) 
D yi + @ 


Again, it is desirable to examine the assumptions in- 
herent in deriving the above expression. Referring to 
Appendix B for details, one can see that V2@ has been 
substituted for the quantity (V + AV)% (V)@ Also, all but 
the first two terms of the binomial expansionof (V + AV)@ 
have been neglected, 


Combining equations (1) and (2) we obtain the following 
equation: 


w Epieteor eno 
OS 
2 (Kg + Ch)(K, + Co) yi +a 


AV 


It can be seen from the above equation that the fre- 
quency deviation Aw is proportional to the change of input 
voltage AV no matter what the value of a is. 


The above equation has been evaluated for the circuit 
shown in Figure 1. The result of this evaluation is a fre- 
quency deviation vs. voltage slope of 323 Hz/mV. 


Referring to Figure 2, it can be seen that this slope 
(323 Hz/mV) is in good agreement with the emperically 
derived slope of 310 Hz/mV. The assumptions imposed 
upon the circuit analysis limited the accuracy of the 
derivation, otherwise even better agreement would have 
been obtained. In particular, the main reason for the 
difference between the two results probably results for 
the neglection of the higher terms of the binomial expan- 
sion of V2@, 


APPENDIX A — HOW EPICAPS WORK 


Epicaps are voltage-variable capacitors based on PN 
junction theory. Conventionally speaking, when we refer 
to a semiconductor diode we normally visualize a 2- 
terminal p-n junction operated in the forward conduction 
region (as a rectifier) or in the reverse avalanche region 
(as azener diode). From this standpoint, the word diode 
applied to a Epicap is actually a misnomer — for while 
the Epicap is indeed a 2-terminal PN junction, it oper- 
ates neither as a rectifier, nor as an avalanche device. 
Rather, it operates principally in the region between for- 
ward conduction and reverse breakdown — the very region 
in which a conventional diode is considered to be cut off. 


In this operating region the PN junction can be repre- 
sented by a capacitor in series with a resistor, 


One rr crea pe se ear 


Ss 


FIGURE 1 


The capacitance, known as junction capacitance, is in- 
herently associated with all PN junctions and, while it 
represents an undesirable parasitic in conventional diode 
operation, it is the specific mechanism that permits the 
device to function as an Epicap, or voltage-variable ca- 


pacitor, This is true because the capacitance value, as 
will be seen later, actually varies as a function of applied 
voltage. This factor cannot only be used for electric 
tuning but also for harmonic generation and parametric 
amplification. 


The resistor is the result of bulk and contact resist- 
ance of the semiconductor material. In Epicap operation 
this resistance is the primary parasitic affecting Epicap 
quality. Great pains are taken in Epicap design, there- 
fore, to hold this resistance value to an absolute mini- 
mum, 


The cause and behavior of the junction capacitance can 
be determined from basic semiconductor theory, as 
follows: 


When a junction is formed between n-type and p-type 
material, there is a cross-migration of charges across 
the junction. Electrons from the n-region cross the 
junction to neutralize positive carriers near the junction 
in the p-region, and "holes'' from the p-region cross the 
junction to neutralize the "excess" electrons near the 
junction in the n-region, As a result of this migration, 
all free charged particles are swept out of the immediate 
vicinity of the junction area, And, in the process, a con- 
tact potential or space charge (about 0.5 V for silicon) 
appears across the junction, Fig. 2a, 


This structure acts very much like a slightly charged 
capacitor, with the depletion layer representing the di- 
electric and the semiconductor material adjacent to the 
depletion layer representing the two conductive plates, 


If anexternalvoltage is connected across the p-n junc- 
tion so as to reinforce the contact potential (reverse 
bias), the depletion layer increases, resulting in a ca- 
pacitance decrease, Fig. 2b. If a forward voltage is 
applied, the depletion layer decreases, Fig, 2c. How- 
ever, if the external forward voltage is made large 
enough to overcome the contact potential, forward con- 
duction occurs and the capacitance effect is destroyed. 


It is obvious, therefore, that the value of the junction 
capacitance is a function of the externally appliedvoltage, 
so long as the junction itself remains reverse biased. 
This relationship is: 


6 @7C 
Cop a eee OE (4) 
G.4.v/el (#4 Vv)’ 
where: 

C = capacitance at voltage V 
So = Capacitance at zero bias 
V_ = voltage across the diode (reverse bias) 
@ = contact potential 
Y = power law of the junction, determined by impurity 


gradient. 


The exponent is a function of the impurity gradient of 
the PN junction. It may vary from approximately 1/2, 
for step junctions, to about 1/6 for specially graded junc- 
tions, For electric tuning the greatest capacity-voltage 
variation is desired so the step junction is generally 
used, 


CONTACT 
POTENTIAL N-TYPE 


FREE ELECTRONS 


eae | 


DEPLETION LAYER 
CAPACITANCE 


DEPLETION LAYER 


FIGURE 2 (A) — A REPRESENTATIVE P-N JUNCTION 

The battery represents the contact potential which must be overcome 
before current can flow. Current carriers act as a capacitor plates 
and the depletion layer is the dielectric. 


SS 


MI DEPLETION 
REVERSE LAYER WIDENS 
BIAS REDUCING 
CAPACITANCE 


FIGURE 2 (B) — REVERSE VOLTAGE FORCES 
carriers away from junction. This widens the depletion layer 
and reduces capacitance. 


DEPLETION LAYER 


NARROWS 
INCREASING 
FORWARD 
BIAS CAPACITANCE 


FIGURE 2(C) — FORWARD VOLTAGE FORCES 
carriers closer to junction or across junction again changing capacitance. 


All PN junctions have to be protected from the corro- 
sive effects of the atmosphere; therefore, packages or 
housings are used. Assocated with the package and the 
internal connections to the junctions are parasitic react- 
ances. Thecomplete equivalent circuit of a packaged PN 
junction operated in the reverse voltage region for elec- 
tric tuning, is shown in Fig. 3. The voltage-variable 
capacitance is Cj; Rg is the series resistance; Rp is the 
junction shunt resistance which generally can be ne- 
glected; Ls is the lead inductance and Ce is the case 
capacitance. 


The admittance of an Epicap including all parameters 
of Fig. 3 is: 


T: 1 
y= jwC, a R re jwL ms (5) 
Ss Ss 1 
1 : 
jie eC; 
p 
where 
ee is high enough to be neglected 
jwC. 
y = jwC, + (6) 


Oo C. + jwC.R 
Sat ies 
Inherent junction Q is defined as: 


mS ela 7) 


If Q is high compared to 1-wLgCythe Epicap has a ca- 
pacitance given by 


2 
Ceq = C. + — z+ (8) 
< foot Ce 
Sue] 


Equation 8shows how equivalent capacity can be modified 
by Lg and Ce. 


Usually operation is well below the self-resonant fre- 
quency Wo = 1/LgCj so that the total capacity is given 
by 


Cea Crare. Cs (9) 


. 
Cp = C, 4 7 (10) 
V 
@ 
where: 
Y = 0.5 for step junction 
@ = 0.5 volts 
The total Q is then 
1 
ee uc Re a 
TS 


The important device information is given by eqs. (10) 
and (11) with eq. (8) being significant at frequencies ap- 
proaching self-resonance. 


In the next section the parameters of specific Motor- 
ola Epicaps will be given and comparisons made to pre- 
viously available voltage tunable capacitors. 


FIGURE 3 — EQUIVALENT CIRCUIT EPICAP 


APPENDIX B 


Replacing transistor by h-parameter representation and drawing only RF circuit of Figure 1 we have 


Writing node equations for the above circuit we obtain 


Q) B, a +C,8) +(E, - E,) (hy) + C8) + [F a ONE E))| 
3 lal 


1 E 
2 
(2) (Ey - E,) (Noo + C)S) + hoy 7 + (Ey - Eg) ne ae =10) 


1 
(3) E, (C,S) + (E, - E,) Ge =O 


2 
Ey E,LC,s 
from Eq3 £, =——*—; @. . i.) -<——_—_ 
Ee ee iquence ome write ic 
oOo (oh 1g) 
plugging this in equation 2 
E,C,S E, 
(EERoHEP) (Heese Ce'S ee heen leer i= = © 
py a Neopior i) AL Geant sae 
[oem e} Z 
Bit Big By - Ey) 
1” h 
11 
Hy ees, (Bie En) CES 
(is SA, S66) cite, Ein, (LS en) 
Date 2 ead) 21 2 2 
h MESIAL 1m) 
il (omme) L 
Hoy N28) boos 1 
Be (owt CoS = + +—) 
opr 1) 2 
nay 1+L,C)8 Rp 
BOT Pet te 
=E. (hoo + C.S+—— - )=0 
122" DS yy Ay 


Assume h-parameters are constant under operating 
conditions and define 


Bos Mod i hoy Pay Bye 
K eth iy ei ea ee 
Were a Ts ae ipa ae - 
‘iy te ll 11 
cs 
E, (K, +C.$+ Ay ihe, (Gh Gn) SO) 
Nas Sen sem me a gsc) 
ONO 
Cs 
E, =E, (K, + C,\S +————,) / (4) 
Ce rarer ENN esta ean oR 
(ome) D 2 


going now to equation 1 


12 
MSGS Ve ROR pe ae [2 if hy | ) 


Mp 
- Ey [hyp + Gps - 2 (1+ hyp] =) 


11 
let Ke eo ah ee [1 +h | 
3 eee? 21 a 
3 h 
11 
a) 
h 4 
12 
Be pe tte (1 +h),) 
11 
E, K, #C)$+ 6,8) =B, (Cg8+K,) <0 (5) 
combining equations 4 & 5 
cs 
(K, + CS + ) (K, +C.S+C_S) 
Lea Daa nclates cae ee 
oo 
E LCL 5%, | xe) 
2 pe > 
CpS+K, 
thus 
cs 
Oo 
(K, +C.Sis ) (K, +C,S+C S$) 
i) SE 141,68 3h cco 
C.S+K Dy Greta 
Dea ae 
CoS Ky : 
K, Ky +CpSKy+,, 10,8" =K,C)$+C,c;8 
2 2 
c,c.s yg C08 wt, 
+ 5+ K,Cps+c,"s + 5-8 
i4L.¢ § 14LC§ 
[ommne) oOo 
- KC. -K,C.8 - KK, =0 


Separating out the odd powers of s we get 


2 2 
K3C)S [: + L,C,§ | + cs Ky + K, c,s [ + L,C,8 | 


2 2 2 
+ K,C)S : + L,C,8 | - K,C)8 [ + L,C,§ | - K,C)s [ + L,C¢,8 | =O 


or 


2 2 
Chg + CphK3b,C)8 + CU K3 + C.K, + C,K,L,C,8 


2 2 
- CK, - CpKyL C$ - CpK, - CpKob C8 =O 


Solving for s? we obtain 


2 2 
S =, [cpt +k y= Ka) CK - cx, 
Cy (Kg - Ky - Ky) + C,K, 
where —— 
is 
(OK) 
3 ; C Kg + CK, 
S =- W, Ch + 
By = BS = Bop 
Sh 
Cans 
D” &=K,-K, 
a4 C Ky & C)K, 
Defining Ke & Ky as Ke= 
Ky -K,- Ky 
oS 
and Ky= 
K, - K,- Ky 
we have LC Wem Sy 48 
fo) D 6 
oo 
[> + | 
s*= “ay! 
5 , Ch + Ke 
w = a. ae (6) 
Ch + K, 


w=wWw + Aw 


a + (2Aw) (w) + ONO = 0, 
Ky + Ch - AC) 


Subtracting equation 6 from equation 7 and 


neglecting the (Aw)? term 


MMC) Glas SiO Cy ge a) 
wy z Ky + Ch = AC), c (Ky + Cp) 
C.K, 4B) _ AC (Ke - Ky) 
(Re Cemarnc) (cme nc) (oh Se 
a (Kp) 
Aw = to  * ay AC, (8) 


Now we must determine ACh in terms of AV so let 


“Do “Do 
Ca Wand OC AC iss 
DR > DW - ae 
po “po 7 te 
es | ad pete 
Dy owe Woe Awe |e 


Nee = 


Applying the binomial expansion to (V + AV)° we get 


a a-1 a(a-1) ,a-2 


Vie av AV + a 


V (AV)” + --- 
2! 


For small AV we can neglect all but the first two 
terms. For AC we now have, 


ACH = Cao [oav] (9) 


yi+@o 


Plugging this expression for AC into the equation for 


Aw, we obtain a linear relation between Aw and AV 


OEE Maes [eav] 


Aw= 
Qu (Oe wee 
K,+C 7) a w|K,+C 
Gincela aaron Oe oreo 2 ae! 
K,+Cyp 2w 2 Ke + Cp 
wW (Kg - Ky) Choe 
Aw= AV (11) 
2 (Kg + Cp) (K, + C)) yite 


The circuit parameters under the conditions of 
operation are 


w= 52 MHz Co = 26 pF and C, = 21 pF 


For the diode 


Cy = Capacitance for a 15 V reverse bias 


Ch = 19.4pF V = 15 volts 


0.465 +AV > _ increase reverse bias 


R 
i] 


Do = 68.3 pF/ 


For the transistor 


hy = 128 ohms hyo = 0.0322 
hoy = 18.0 hoo = 5.44 mmhos 
Roya 4 
K, = hoo Sree a.0 F Ry = 49.5 
11 L 


3 0.580 1 


K, = 544X10~ --—“—+ 
128 49.5 
-3 
Ket iy Os 
Pork Serer) 
K, =h + 
Oe 22 ‘ 
ial 11 
Komen 5 44 Cap ne 453 KOT re ror 
‘i 2 
128 Roe de SS 
1 1-hy 
Loe hey Mare [ + hs] R, = 1302 
3 h 
11 
Ky = 7.70X Eee hy) [9] 
128 
= = 
K, = 187X108 
h 
12 
Ky = hoo - a + hy,) 


11 


3 0.0322 C.K, = 4.08pF - 8 


5.44 X 10 (19) o°3 
128 
K, = 0.96X 1072 e “. Kg = 323 pF 

K, = 31.4 pF 

Cos : mer | 

K,+K € ae 

aw -=W, Gaiety, DO 7 

CoK, + CK, 2 (Kg + Cp) (K, + Cp) yi-465 

a ar aS | 
Therefore 

C.K 
u tou 
ea aes US . 
52 354 68.3 
W SS wee, —_——_—_—_—_—_— ———s 
e a q (0.465) 6.4) (a42) “a2 oY 
K, - Ky = 14K 10° 8 d 
MHz Hz 

AW = (0.323 —) AV, or, AW = (323 ) av 

= 0.443 pF - U V MV 


MOTOROLA Semiconductor Products Inc. 


BOX 955 e PHOENIX, ARIZONA 85001 e A SUBSIDIARY OF MOTOROLA INC. 


1014 PRINTED IN USA $-66 IMPERIAL LITHO 9300 


rs _—* 


MODEL FM-1 | 
TRANSCEIVER 


TECHNICAL 
DESCRIPTION 
AND 
OPERATING 


: INSTRUCTIONS iS 
D 


HAMMARLUNG 


is Hammarlund Manufacturing Company, Inc. 
f" A Giannini Scientific Co. 

73-88 Hammarlund Dr., Mars Hill, N. C. 

Export Department: 13 East 40th Street, New York 16, N. Y. 


© 


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pepe eee 


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1/24/73 bole mon Deh ase one Perl cheers Mo tos | one moytGh prrrth. FW TimitiXae aaQ\27 


a. Lenteperfore \ Apyryed 


Por yttale > 7152, 400 R 153. 490 
h frp Crdtud 9 pte feats fom Sper Cape be, ©,0025", Gor Wort. Paraed fhe ent stie, 


OPERATION AND MAINTENANCE MANUAL 


Model FM-1 Transceiver 


Manufactured By 
Hammarlund Manufacturing Co. 
Mars Hill, North Carolina 


Paragraph 


TABLE OF CONTENTS 


SEC TION I - INTRODUCTION 


Purpose of Equipment 

Functional Description 

Battery Installation .... 

Physical Description : A Aine 
Operational Characteristics acl Effective Ringe 


SECTION II - SPECIFICATIONS 


General shire 
Transistor Complement 
Diode Complement 
Fuse Complement 
Crystal Specifications 


SECTION III - INSTALLATION AND ALIGNMENT PROCEDURES 


Eide 44 6 6 6 GSS 6 6 oH 
Preliminary Procedures 

Standard Whip Antenna 

Tactical Antenna 29) o- 
Mobile Antenna ; 

The FM-1 As A Base setione 
Alignment Procedures 


SECTION IV - OPERATION 


General . ane 

Operating Controls - - +--+ ++ + ++ s+. 
Starting and Stopping peo 

Squel Chimca-arem cw: @sueeMnr egret «nom rae 
Antenna Socket 

Phone Jack 


External Battery ae 
Push-To-Talk Switch . 


SECTION V - PREVENTIVE AND CORRECTIVE MAINTENANCE 


General... Be PP et Apo tw ere 
ThecryeLOoeretions De Pe Shas Oa ae a ee 
Receiver Circuits 

Transmitter Circuits . 

Modulator Circuits care 


ii 


Paragraph 


5-20 
9-22 
5-24 
5-25 
5-26 


6-1 


Porc pol opt el cree rah bomb Bole Pi 
ROBIE ROSIE ers wee ee es ES 4 RON ES 


TABLE OF CONTENTS (CONT) 


Control Circuits 

Test Points - 
Corrective Maintenance 

Trouble Shooting ome 
Parts Replacement and nithicer 


SECTION VI - PARTS LIST 


General 


SECTION VII - INSTALLATION, OPERATION, 
MAINTENANCE INSTRUCTIONS - ACCESSORY ITEMS 


General 

Two- Frequency Gonversion Kit 

Description 

Installation of Two- Ereceren Switch . 
Alignment of Two-Frequency Kit 

Operation Limitations of Two-Frequency Kit 
Operating Principles for Two-Frequency Kit 
Maintenance of Two-Frequency Kit 

RP-1 Back-to-Back orcs Repeater . 
Description .. . 4d . 
Installation of RP-1 Ronee : 

Battery Installation in RP-1 Rereuters 
Antenna Installation for RP-1 Repeater 
Successful Repeater Operation 

Theory of Operation for RP-1 enenters 
Maintenance of the RP-1 Repeater . 


SECTION VIII - SCHEMATIC DIAGRAMS 


SECTION V - PREVENTIVE AND CORRECTIVE MAINTENANCE (cont'd) 


AND 


6-1 


pubes eh ey Pah Ey Tah Suk Gah ale Sak oe is 
DMONINARAWBWWNNNHP HE EH 


(0.2) 
i 
a 


ILLUSTRATIONS 


Model FM-1 Handheld Transceiver 

Circuit Board Assembly : 

Model FM-1 Adjustments and Features 
Operating Controls 

System Block Diagram 

Two- Frequency Conversion Kit 

RP-1 Back-to-Back One-Way Repeater . 

RP-1 Repeater Functional Block Diagram 
Two-Frequency Kit Schematic Diagram 

Model FM-1 Transceiver Schematic Diagram . 
Model RP-1 One-Way Repeater Schematic Diagram 


TABLES 


Model FM-1 Transceiver Specifications 
Transistor Complement 

Diode Complement . 

Fuse Complement 

Crystal Specifications 

Test Points ; 
Receiver Voltage Moa surpments : 
Transmitter Voltage Measurements 
Voltage Chart for RP-1 Repeater 


as) 
: 


a a eRe a Mets. 
< 


Pon OP Ww WH DW OI bb 


aoaoonnrn on b&w Ww 


Pes bee ae 
OoONoounwnw ci & wr 


Naoanounwdnd nv WD WD W 


Figure 1-1. 


Model FM-1 Handheld Transceiver. 


SECTION | 


INTRODUCTION 


1-1 PURPOSE OF EQUIPMENT 


1-2 The Hammarlund Model FM-1 hand- 
held transceiver (figure 1-1) is designed 
to provide reliable communication from 
a portable position to a portable or a 
fixed site. The FM-1 has been designed 
tobe readily carried in the left hand. The 
basic equipment provides voice communi- 
cation by using FM modulation. Acces- 
sory kits allow the equipment to be con- 
verted to two-channel operation and/or 
MCW (modulated continuous wave) opera- 
tion. The equipment has been designed 
to work with other FM-1 or FM-5 equip- 
ment. However, the equipment is also 
capable of working with other FM equip- 
ment provided that (1) both equipments 
are on the same frequency, and (2) both 
equipments use the same deviation in 
both the receive and transmit conditions. 
Frequency of operation is 150 - 172 me. 


1-3 FUNCTIONAL DESCRIPTION 


1-4 The Model FM-1 equipment operates 
from eight 1.5 volt D cells which are 
carried inside the unit, or from an ex- 
ternal supply of 12 volts. All equipments 
are transistorized for minimum battery 
drain and maximum efficiency. 


1-5 BATTERY INSTALLATION 


1-6 The transceiver is loaded with eight 
1.5 volt D cells. The bottom plate is 
removed by undoing the large head bolt 
with a coin or screwdriver. The batter- 
ies are inserted as shown on the trans- 


ceiver labelling. Care must be used to 
insert the cells in the proper direction, 
making certain that no one cell is turned 
around. 


1-7 PHYSICAL DESCRIPTION 


1-8 OPERATIONAL CHARACTERISTICS 
AND EFFECTIVE RANGE 


1-9 Normal handheld operation requires 
the use of the standard whip antenna. 
Other antennas may alsobe operated with 
the FM-1 as described in Section III, 
paragraph 3-6 through 3-12. = 


1-10 The FM-1 is designed especially for 
city operation among high levels of im- 
pulse interference. The noise -immune 
squelch will not normally break on igni- 
tion and other forms of electrical inter- 
ference. The FM-1, when working into a 
base station FM-5, may be expected to 
operate effectively across cities up to 
distances of 5 kilometers or more pro- 
vided the FM-5 antenna is above sur- 
rounding buildings. In weak signal areas 
it is important that the FM-1 be held 
vertical, and not slanted at 45° angles. 


1-11 When the FM-1 is connected to the 
ground plane antenna, normal communi- 
cation may be expected to slightly exceed 
line-of-sight distance antenna to antenna. 


1-12 Increased operating distance over 
the standard whip antenna may be obtained 
by use of the high gain tactical antenna. 


SECTION II 


SPECIFICA TIONS 


2-1 GENERAL 


2-2 Specifications for the Model FM-1 
are provided in Table 2-1. 


2-3 TRANSISTOR COMPLEMENT 


2-4 The transistor complement for the 
equipment is provided in Table 2-2. 


2-5 DIODE COMPLEMENT 


Table 2-1. 


Minimum Carrier Power Output 


2-6 The diode complement for the equip- 
ment is provided in Table 2-3. 


2-7 FUSE COMPLEMENT 


2-8 The fuse complement for the equip- 
ment is provided in Table 2-4. 


2-9 CRYSTAL SPECIFICATIONS 


2-10 The crystal specifications for the 
equipment are provided in Table 2-5. 


Model FM-1 Transceiver Specifications. 


(6! 


Minimum RF power output over the full frequency range (150 - 172 mc): 1 


watt at 12 volts. 


Carrier Frequency Stability 


ty OzsKe 


Total frequency drift for any cause does not exceed +0.0025% of the assigned 
center frequency from -30° to +50°C ambient. 


Modul. tion 


Navew Ran 
4 Gi ke modulation deviation - sans band. 


Ki? 
Spurious and Harmonic Radiation 


A aypotiur 2m 


Fea modulation pre-emphasized in accordance with EIA standards. 


All spurious radiation is at least 40 db below level of carrier. 


FM Hum and Noise Level 


- 


At least 40 db below standard test modulation where full-rated-system devia- 
tion is +15 ke (''D" cell supply or external 12-volt battery not charging). 


AM Hum and Noise Level 
The ratio of the peak ac voltage to the de voltage detected from the carrier 
does not exceed -35 db. . 25h GoO-ZS0O BW 2,24¥¥e/s 


Modulation ES 


2-1 


Table 2-1. Model FM-1 Transceiver Specifications. (cont'd) 


Modulation Limiting (cont'd) 
for an input level 20 db above the level producing 2/3 rated system deviation 
at 1000 cps. 


Audio Frequency Harmonic Distortion 
10% maximum, with standard test modulation (EIA). 


Audio Frequency Response 
The audio response does not vary more than +2 or -8 db from a true 6 db per 
octave pre-emphasis characteristic from 400 to 2500 cps as referred to the 

1000 cps level. 


Output Impedance 
Suitable for whip antenna, or to match an external 50-ohm ground plane type 
antenna. 


Duty Cycle NéT DESIGNED FoR | WATT OVTPLT ConTIW URES OR AM ATGOR SERUICE , 


6 seconds receive at rated audio power output, 6 seconds transmit at rated 
RF power output, and 48 seconds in the standby condition. 


Current Drain 
Maximum. current drain with 12 volts de at full rated RF power output is 350 , 
milliamperes. P= €T= 4,2” x LEAS Aidly Cyd 2G eae poles 


CS ae poz. oF 8 
3 CTbWK as ¢ o76 
Sensitivity ee O. 544 jae Ay ragi- 


Better than 0.7 uv for 20 db quieting. 
0.7 microvolts is the maximum amount of signal from an unmodulated stan- 
dard input signal source that is required to produce 20 decibels of noise 
quieting measured at the receiver audio output. 


Squelch Sensitivity 
0.35 microvolts is the maximum value of the standard test input signal source 
which will open the receiver squelch. The squelch control is adjustable with 
screwdriver, and is accessible from the top panel behind a snap-type water- 
proof cover. 


Modulation Acceptance Bandwidth PES Ke Rawewhend 
Minimum modulation acceptance bandwidth is +15 KC (wideband). 


Adjacent Channel Selectivity 
Adjacent channel selectivity is a minimum of 50 db at +60 KC. 


Spurious and Image Response Attenuation 
At least 40 db down at all frequencies. 


Oscillator Stability + 4 01S KC 
Total frequency drift for any cause does not exceed +0. 0025% of the assigned 


Table 2-1. Model FM-1 Transceiver Specifications. (cont'd) 


Oscillator Stability (cont'd) 
center frequency from -30° to +50°C ambient. Oscillator crystals are her- 
metically sealed in HC-25/U holders. The local oscillator is adjustable 
electrically so that the receiver may be tuned to the exact operating fre- 
quency. 


Residual Hum and Noise Level 
At least 40 db down from rated output with standard test modulation (''D" cell 
supply or external 12-volt battery not charging). 


Audio Frequency Response 
Within +2 and -8 db of a standard 6 db per octave de-emphasis curve over the 
range of 400 - 2500 cps. 


Audio Power Output 
At least 150 milliwatts minimum to speaker. At least 10 milliwatts to ear- 
phone jack accessible from top panel behind a snap-type waterproof cover. 


Audio Distortion 
Less than 10% at 2/3 rated deviation with 1000 cycle tone. 


Antenna Input Impedance 
To match whip antenna or 50-ohm external antenna. 


Duty Cycle 
Continuous. 


: (2%, 008 
Current Drain PoET= 0,096 


Maximum current drain with 12 volt de: Receive (no signal), 8 milliamperes; 
Receive, 40 milliamperes with full rated audio output. P=,, y o¥o= 0, 48w ¢ 


Table 2-2. Transistor Complement. 


REFERENCE : 
DESIGNATION DONG eAD FUNCTION 


RECEIVER SECTION 


2N3478 -- RF Amplifier 
2N3564 lst Mixer 
not assigned 

2N3564 Oscillator 
2N3693 2nd Mixer 


not assigned 

2N3693 1st IF Amplifier 
2N3693 2nd IF Amplifier 
2N3693 3rd IF Amplifier 


Table 2-2. Transistor Complement. (cont'd) 


REFERENCE 
DESIGNATION TYPE FUNCTION 


RECEIVER SECTION 


2N3693 4th IF Amplifier 
2N3693 Limiter 

2N3693 1st Audio 
2N3567 2nd Audio 
2N3567 Class B Audio 


2N3638 Class B Audio 
2N3693 Noise Amplifier 


TRANSMITTER SECTION 


2N3693 Audio Amplifier 
2N3693 Clipper 

2N3567 Amplifier/Integrator 
2N3693 Oscillator 

2N3693 Modulator 


2N3693 Tripler 
CH2369 Tripler 
CH2369 Doubler 
2N3564 1st Amplifier 
2N3866 2nd Amplifier 


40280 Final Amplifier 


Table 2-3. Diode Complement. 


REFERENCE 
DESIGNATION FUNCTION 


RECEIVER SECTION 


AA119 Discriminator Diode 
AA119 Discriminator Diode 
IN34A Noise Rectifier 
IN34A Noise Rectifier 
1N34A Squelch Gate 


T4 Bias Regulator 
TS4 Bias Regulator 
Test Rectifier 


2-4 


Table 2-3. Diode Complement. (cont'd) 


REFERENCE 
DESIGNA TION TYPE FUNCTION 


TRANSMITTER SECTION 


D106 AA119 Diode 


CHASSIS SECTION 


External Protect 
Diode 


Table 2-4. Fuse Complement. 


REFERENCE 
DESIGNATION FUNCTION 


1.5 AMP, 8 AG Power Input Circuit 


Table 2-5. Crystal Specifications. 


RECEIVER CRYSTAL 


Description 
Metal-plated quartz plate wire or spring mounted in metal holder. 


Mode of Operation 
Fundamental. 


Correlation 
Series Resonance. 


Holder 
a. Equivalent to Military HC-25/U Holder. 
b. Holder HC-25/U is anodized or painted black in color. 
c. The actual operating frequency, not the crystal frequency, is stamped on 
the side of the receiver oscillator crystal. 
The frequency stamp on the receiver crystal is preceded by an "'R". 


Frequency Range 
16.0 to 19.50 megacycles. 


Operating Temperature Range 
-30° to +60°C 


Tolerance on Nominal Frequency 
Crystal is finished at a nominal room temperature of +25°C +3°C to +0. 002% 
of the specified frequency. The crystal frequency does not drift more than 


Table 2-5. Crystal Specifications. (cont'd) 


Tolerance on Nominal Frequency (cont'd) 
+0. 002% from the frequency at 25°C as the temperature is varied from -10°C 
tozro0lC. 


Effective Series Resistance 
15 ohms maximum (16.0 to 19.50 mc). 


Level of Drive 
Maximum level of drive 1.0 milliwatts. 


Roca F = Fe A o.4ot4 ke 6.769 0. 4o4#? ) = (6.1 AMG 
et z 
| : 


PISGAl 


Static Capacitance 
6 put +1 pupt 


Condition of Test Holder 5 ot TPS Fe 
Grounded. Mx Pp he abs 2awslen pola. y 


Formula - Multiplication Factor 


: f, = Lo Ske FA rer vier | 
_ Fe - 455 KC n eee 16, 25 60 Pw A cnet 


9 Senies ALA oe A. pos 
= Crystal frequency. 
x 
F = Carrier frequency. Rk |46.76°H2 
a 


TRANSMITTER CRYSTAL 


Description 
Metal plated quartz plate wire or spring mounted in metal holder. 


Mode of Operation 
Crystal designed to operate on the fundamental thickness shear frequency of 
the quartz plate. 


Correlation aera 
Crystal designed to operate into load capacitance of 32 wuf +0.5 pyf. 


Holder 
Equivalent to Military HC-25/U Holder. 
Holder HC-25/U is anodized or painted black in color. 
The actual operating frequency, not the crystal frequency, is stamped on 
the side of the transmitter oscillator crystal. 
The frequency stamped on the transmitter crystal is preceded by a ''T". 


Frequency Range 
8.0 to 10.0 megacycles. 


Operating Temperature Range 
-30 to +60°C 


2-6 


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1N456 


R30 
1OK,1/4W 


R31 
10K, 1/4W 


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Table 2-5. Crystal Specifications. (cont'd) 


Tolerance on Nominal Frequency 


Crystal is finished to +0.0020% of the exact frequency required at a nominal 
room temperature of +25°C. Crystal unit uses an AT cut blank and does not 
exceed a frequency drift +0.0020% of frequency at 25°C, +3°C from -30°C to 


+60°C. 


Effective Series Resistance 
35 ohms over frequency range. 


Level of Drive 
One milliwatt over frequency range. 


Static Capacitance 
4 to 6 upt 


Condition of Testing To Xt Tes Fhe | 
Holder grounded. MT, Ping at 2h AaQonp 


Formula - Multiplication Factor 
Fe 
18 


—< 


Crystal frequency. S.ILOHHe furcamerle L parotls ay 


Carrier frequency. 7T)46./60Kbs 


2-7 


SECTION Ill 


INSTALLATION AND ALIGNMENT PROCEDURES 


3-1 UNPACKING 


3-2 The equipment may be shipped in 
either export or domestic packing cases. 
In either event, no special unpacking 
procedures are necessary. When new 
equipment is received, select a location 
where the cases may be unpacked without 
exposure to the elements. 


3-3 PRELIMINARY PROCEDURES 


3-4 To prepare the equipment for use, 
perform the following steps: 


1. Inspect equipment for any possible 
damage incurred in shipment. Re- 
port damage to responsible per- 
sonnel immediately. 


CAUTION 


Do not attempt to place damaged 
equipment in operation as it may 
further impair the instrument. 


2. See Figure 3-1 for the location of 
crystals Y101, or their sockets in 
the event crystals are not in- 
stalled. Crystals for the re- 
ceiver section are identified with 
the channel frequency and the 
letter "R" on top of the crystal 
case. DO NOT ATTEMPT TO 
USE CRYSTALS WITH OTHER 
MARKINGS UNLESS CRYSTAL 
FREQUENCY AND MODE OF OP- 
ERATION ARE KNOWN. Crystals 
for the transmitter section are 
identified with the channel fre- 
quency and the letter ''T" on the 


top of the crystal case. DO NOT 
ATTEMPT TO USE CRYSTALS 
WITH OTHER MARKINGS, UN- 
LESS CRYSTAL FREQUENCY 
AND MODE OF OPERATION ARE 
KNOWN. Crystals used in the 
transmitter section are operated 
in their fundamental mode. The 
transceiver is normally shipped 
with crystals installed and pre- 
aligned for these frequencies. In 
the event crystals are not installed, 
or it is necessary to change fre- 
quency of operation, obtain the 
desired crystals and insert firmly 
in sockets. Refer to Table 2-5 
for crystal specifications. i 


Remove the end plate and insert 
eight 1.5 volt D cells as shown on 
transceiver labeling. 


. Replace the end plate and connect 


the standard whip antenna. 


Turn the volume control fully on 
(clockwise). A loud hissing noise 
should be apparent. If there is no 
hiss, lift the squelch control spring 
loaded cover and with a screw- 
driver, turn the squelch control 
until the hiss is audible. Next, 
turn the volume control to the 
half-on position and set the squelch 
control until receiver hiss is only 
just quieted. Do not exceed this 
point or a large signal will be re- 
quired to open the squelch again. 
The transceiver is now ready for 
operation. A more sensitive 


AUDIC fiw VE, 
gli2 diidis preamp. 
Gis Audio diver 

B—T(03 p YPYK 
audi pom RL 


L124 


AF oT ond GHD 
C232 


C231 
C230 


C229 Bt XH 


C228 


L122 
C220 


L121 
L120 
C217 


RX CRYSTAL Y101 


al Ter L105 FREQ ADJUST | 
oO : 
Recuk AW L103 : 


L101 


L102 7 
pevirreen) DEVIATION —! KF = ow, C185 FREQ 
CONTROL R191 ee Grew et ADJ. 


JUMPER (NOTE 1) X104 


MOUNTING HOLE - FC oe 
X106 


TX CRYSTAL Y102 


NOTE 1. 
REMOVE JUMPER FOR FITS IN X105-X109 


TWO FREQUENCY OPERATION 


Figure 3-1. Circuit Board Assembly. 


3-2 
G 


squelch setting may be obtained by 
setting the gain control to the de- 
sired listening level before the 
squelch control is adjusted. 


3-5 The above directions assume that the 
transceiver has been adjusted at the 
factory, and is on the correct frequency. 
If alignment or frequency adjustments are 
required these may be carried out ac- 
cording to the directions in paragraph 
3-15. 


3-6 STANDARD WHIP ANTENNA 


3-7 The standard whip antenna is nor- 
mally used with the FM-1. Only one 
antenna length is used regardless of fre- 
quency. Consequently, best results are 
obtained if transmitter output circuits 
are tuned to the antenna. After the trans- 
mitter has been aligned into a dummy 
load as described in paragraph 3-15, the 
standard whip antenna should be con- 
nected. A field strength meter should 
next be set up at a convenient distance 
from the instrument, and capacitors, 
C230, C231 and C232 adjusted for max- 
imum output as determined by the field 
strength meter. Best operation is always 
obtained when the FM-1 is held in a ver- 
tical plane. This is particularly true 
when the signals are weak. Even if the 
unit is held only a few degrees off verti- 
cal when receiving a weak signal, the 
signal may completely fall out and the 
squelch close. 


3-8 The FM-1 should preferably always 
be operated in the clear, away from 
buildings, iron structures and trees. 
Buildings, tree plantations, and jungle 
will seriously absorb both transmitted 
and received signals. Wet foliage es- 
pecially will considerably reduce the 


working range of the FM-1 equipment. 
3-9 TACTICAL ANTENNA 


3-10 The tactical antenna, when used 
with the FM-1, will increase the ground 
wave signal at the expense of the sky 
wave signal. The tactical antenna should 
be used only for ground-to-ground con- 
tacts and not for air-to-ground contacts. 
As with the standard whip antenna, best 
results will be obtained ifthe transmitter 
output circuits are tuned into the antenna 
with the aid of a field strength meter. 


3-11 MOBILE ANTENNA 


3-12 The mobile antenna may also be 
used with the FM-1. Due to the increased 
ground plane area, antenna efficiency will 
be increased and consequently, a greater 
range will be obtained. As with the stafi- 
dard whip antenna, best results will be 
obtained if the transmitter output circuits 
are tuned with the antenna with the aid of 
a field strength meter. 


3-13 THE FM-1 ASA BASE STATION 


3-14 The FM-1 may also be used as a 
base station in conjunction with the 
ground plane antenna. The ground plane 
antenna should be located as high as 
possible. AS VAF communication is 
primarily line-of-sight, every effort 
should be made to allow the two antennas 
to "see" each other. This condition will 
allow the best possible communication 
between the two stations. As with the 
standard whip antenna, best results are 
obtained if transmitter output circuits 
are tuned to the antenna with the aid of a 
field strength meter. 


3-15 ALIGNMENT PROCEDURES 


3-16 There are several alignment pro- 
cedures which may be followed. The 
simplest of these is described in para- 
graphs 3-17 and 3-19. Test equipment 
required for alignment consists of: a 50 
microampere meter; a signal generator 
covering the range 455 ke, the IF fre- 
quencies 16 mc to 20 mc, and the input 
frequencies 150 mc to 172 mc; a fre- 
quency meter or counter; a wattmeter; 
and a deviation monitor. 


3-17 RECEIVER ALIGNMENT 


3-18 To align the receiver, proceed as 
follows (see Figure 3-2): 


1. With the 50 wamp meter connected 
to pin 5 of test socket (J-103), con- 
nect signal generator at 455 kc to 
input of FL101 at approximately 
100 wv. Peak L111 for maximum 
(100 uv provides 20 db). Feed 
generator through 0. 0luf and3.3K 
ohm resistances in series. 


2. With 50 wamp meter connected to 
pin 4 of test socket, adjust L112 
for zero output. 


3. With 50 wamp meter connected to 
pin 5 of test socket and signal 
generator (through 0. 01 uf capaci- 
tance) to base of Q102, feed ina 
Signal at crystal frequency plus 
455 ke at the lowest possible level 
to start an upward swing in the 50 
uamp meter (13 uv provides 20 db 
of quieting, approximately 15 
wamps). Adjust L107, L108, L109 
and L110 for maximum. At the 
same time, reduce generator out- 
put to lowest possible level to pre- 
vent overload. 


4. With 50 wamp meter at pin 7 of 
test socket, peak oscillator coil 
L125 for maximum (approximately 
25 wamps). 


5. Using Counter, adjust L105 to 
crystal frequency. 


6. With 50 swamp meter connected to 
pin 5 of test socket, and signal 
generator set at receive frequency 
and connected to antenna, feed in 
signal at lowest possible level to 
start an upward swing in 50 wamp 
meter. Adjust L101, L102, L103, 
L104 and L106 for maximum, at 
the same time reducing signal gen- 
erator to lowest possible level 
(approximately 0.3 - 0.5 wv pro- 
vides 20 db of quieting). 


7. Finally, touch up L101 through 
L104, L107 through L110 for max- 
imum quieting in speaker. 


3-19 TRANSMITTER ALIGNMENT 


3-20 To align the transmitter, proceed 
as follows: 


1. Connect positive lead of 50 wamp 
meter to chassis, and negative 


lead to test socket (J-103). 


2. Connect wattmeter and 50 ohm 
load to antenna jack (J4). 


3. With 50 wamp meter at pin 2 of 


test socket wadjust Lil Omi) 7s C207, 


and C209 for maximum reading. 
Typical readings should be between 
10 and 15 wamps. 


4. With meter at pin 3 of the test 


socket, peak L118, L119 and C215 
for a maximum reading. Typical 
readings should be between 35 and 
40 wamps. 


With meter at pin 6 of the test 
socket, adjust C217, C220, C228 
and C229 back and forth for maxi- 
mum reading. Typical readings 
should be between 20 and 30uamps. 


Tune €230, C231, C232 for maxi- 
mum power out. 


RX FREQUENCY 
ADJUST 1105 


TX FREQUENCY 
ADJUST C185 


DEVIATION 
BATTERY CONTROL R191/' 


COMPARTMENT 


10. 


SPEAKER/MICROPHONE 


LS1 


Repeat steps 3, 4 and 5 for maxi- 
mum power out. 


Adjust L115 for best recovered 
audio in a standard receiver or a 
deviation monitor. 


Using frequency meter or counter, 
adjust C185 for channel frequency 
and repeat above steps if neces- 
sary. 


Set deviation by adjusting deviation 
control R191 until correct devia- 
tion is shown on the monitor. 


SQUELCH 
R2 


PHONE JACK 
J2 ‘ 
AUDIO GAIN 


ANTENNA 
J3 


PUSH-TO-TALK 
SWITCH S1 


Figure 3-2. Model FM-1 Adjustments and Features 


3-5 


SECTION IV 


OPERATION 


4-1 GENERAL 


4-2 This section describes how to op- 
erate the Model FM-1 transceiver. 
Proper operation of the instrument is 
predicated upon it being installed and 
aligned in accordance with instructions 
in this manual. 


4-3 OPERATING CONTROLS 
(Figure 4-1) 


4-4 STARTING AND STOPPING. The 
equipment is in operation when the OF F/ 
VOLUME control is in the ON position. 
Volume is increased by turning the con- 
trol in a clockwise direction. The trans- 
ceiver is turned OFF when the OFF/ 
VOLUME control is turned fully counter- 
clockwise. A pronounced click will indi- 
cate when the OFF position has been 
reached. The operator should be careful 
to avoid turning the control beyond the 
OFF position to prevent damage to the 
control. 


4-5 SQUELCH. The squelch control, 
which is located behind the spring loaded 
cover, is preset prior to operation (para- 
graph 3-4, step 5) to set the level of 
squelch action. To adjust, the cover is 
lifted and the control turned until the hiss 
in the receiver just disappears. The 
squelch control should not be rotated be- 
yond this point. The squelch circuit 
enables the receiver audio to be switched 
off in the absence of signal. The closer 
the control is set to the break point, the 
smaller the signal required to open it. 
The squelch control is normally set with 


the volume control at the normal listen- 
ing level. 


4-6 ANTENNA SOCKET. The standard 
whip antenna is connected to the antenna 
socket. Alternatively, the tactical an- 
tenna, the mobile antenna or the ground 
plane antenna are connected to the anten- 
na socket. 


4-7 PHONE JACK. The phone jack is 
located behind the jack cover labelled 
PHONE. When the head phone jack is 
plugged in the speaker is automatically 
disconnected. 


4-8 EXTERNAL BATTERY JACK. The 
external battery cable is plugged into the 
external battery jack which is located 
under the jack cover labelled EXT BAT. 
The external battery source is used in 
fixed or mobile operation. The internal 
circuitry includes a diode to prevent 
damage to the transceiver if the battery 
leads are inadvertently incorrectly polar- 
ized. 


4-9 PUSH-TO-TALK SWITCH. The 
push-to-talk switch is located on the side 
of the transceiver, and is normally de- 
pressed with the fingers of the left hand. 
When the switch is pressed, the trans- 
ceiver is placed into the transmit condi- 
tion and the panel controls are rendered 
inoperative. The operator should speak 
across the mouthpiece with the mouth- 
piece nearly touching the lips. Speaking 
directly into the mouthpiece will cause 
blasting in the receiver. 


4-2 


EXT. BAT. +. ANTENNA. 


| Nausea a 


SQUELCH PHONES VOLUME 
a, ~~. 


Figure 4-1. Operating Controls. 


; 
\ 
| 
/ 
4 
| 
| 
| 


DUMMY 
CONNECTOR 


SECTION V 


PREVENTIVE AND CORRECTIVE MAINTENANCE 


5-1 GENERAL 


5-2 This section describes the basic 
principles of operation for the Model 
FM-1, and offers maintenance informa- 
tion to assist the technician in trouble- 
shooting and repairing certain malfunc- 
tions which could occur. 


5-3 THEORY OF OPERATION 


5-4 The FM-1 transceiver is comprised 
of a receiver and a transmitter (see Fig- 
ure 5-1). The speaker of the receiver is 
used aS a microphone in the transmit 
mode of operation. 


5-5 RECHIVER® CLR CUI ES. Theire- 
ceiver is a double conversion super- 
heterodyne in which one oscillator serves 
as both the first and the second source of 
injection voltages. All transistors in the 
receiver are silicon. Sjlicon transistors 
are relatively free from breakdown due 
to overload from adjacent transmitters, 
and are able to be operated under condi- 
tions of considerable heat. 


5-6 The RF amplifier Q101 is operated 
in the common emitter mode; its de path 
is in series with the local oscillator, 
Q104. The RF input circuit consists of 
L101, C101 and C102. The two capaci- 
tors form a capacitive divider providing 
an impedance match to Q101. Output 
from the RF amplifier is fed to bandpass 
coupler L101 and L103. Output from 
L103 is fed by means of an inductive tap 


on L103 to the first mixer Q102; for dc, 
Q102 is in series with Q105, the second 
mixer. 


5-7 Following the first mixer are four 
tuned circuits, L107 through L110. Out- 
put from L110 is inductively coupled to 
the second mixer Q105. These circuits 
offer a high degree of selectivity to un- 
wanted signals. The first IF frequency 
may be determined through the following 
relationship: 


Fue (We cio) ces 
where F, = carrier frequency 
Fx, = crystal frequency 


5-8 Local oscillator Q104 operates in 
the fundamental series mode. The oscil- 
lator is a simple feedback type with feed- 
back being obtained through a small 
winding over the main tuned circuit which 
consists of L125 and the associated ca- 
pacitor C113. Crystal Y101 is in series 
with the feedback loop, representing a 
high impedance to all frequencies except 
that of the crystal. Inductor L105 "pulls" 
the crystal, allowing considerable adjust- 
ment of the frequency. 


5-9 Capacitor C113 has a twofold pur- 
pose; to tune inductor L125 to the crystal 
frequency, and to pass on harmonics of 
the crystal frequency to the tuned circuit 
L106 and C111. 


5-10 Basically, the oscillator operates 
between 16.6 mc and 19.06 mc. Output 


5-1 


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90TT FOTT 
YaL TI 


OTTT 
- LOTT 
YALTIA 


LZ1© 
YaIIITId NV 
TVNIA 


iagram. 


System Block D 


5-1 


igure 


F 


5-2 


from the oscillator is fed directly to the 
second mixer Q105 At the same time 
L106 and Cl11 selects the eighth har- 
monic of the oscillator. Tuned circuit 
L104 and C109 together with L106 and 
C111 form a highly selective bandpass 
coupler to remove the unwanted harmon- 
ics, and the output is fed to the first 
mixer, Q102. In aligning the receiver, 
care must be exercised to see that only 
the eighth harmonic is used. It is a sim- 
ple matter to tune the oscillator to the 
tenth harmonic and allow an input signal 
only 910 ke away from the wanted signal. 


5-11 It should be realized that with this 
system, the high frequency IF system 
L107 through L110 must be retuned each 
time the input circuits are tuned to a new 
frequency. 


5-12 Following the second mixer is a 
highly selective ceramic filter, FL101. 
This filter requires no alignment, and 
remains permanently tuned to the center 
frequency of 455 kc. 


5-13 Transistors Q107 through Q110 are 
resistance-coupled IF amplifiers. Due 
to the extremely good selectivity obtained 
from filter FL101, further selectivity is 
not required. Each of the amplifiers are 
series connected for dec. Some limiting 
action takes place in the IF amplifier, 
especially the latter stages on larger 
signals. However, limiting is mainly 
effected by Qill. The limiter trans- 
former L111 is link coupled to discrimi- 
nator transformer L112, and from there 
the output is fed to diodes D101 and D102. 
A de-emphasis network consisting of 
R150 and C157 connects the discriminator 
output to the first audio amplifier Q112 
through volume control R3. 


5-14 Simultaneously, output from the 
discriminator is fed to the noise ampli- 
fier Q116 through C165 and squelch con- 
trol R2. The noise amplifier is designed 
to pass only noise, all audio signal being 
removed by a combination of negative 
feedback and small coupling capacitors. 
The output is rectified by D103 and D104 
and the resultant de fed by the diode gate 
D105 to the first audio transistor, Q112. 


5-15 Under the no-signal condition the 
rectified noise voltage causes amplifier 
Q112 to be saturated and the voltage at 
the collector of Q112 to be at or near 
zero, causing the next amplifier 
stage Q113 to cut off. The presence 
of a signal however causes adrop innoise 
and a reduction in the dc bias fed through 
diode gate D105. The diode gate opens 
and direct-coupled amplifier Q112 and 
Q113 is allowed to normally operate, 
allowing the signal to reach the speaker. 


5-16 The class B audio amplifiers Q114 
and Q115are series connected for dc (that 
is, each transistor has 6 volts across it 
from collector to emitter). However, 
from an ac point of view the two transis- 
tors are in parallel. The upper transis- 
tor (Q114) is an NPN and the lower tran- 
sistor (Q115) is aPNP. When the incoming 
signal is positive going only the NPN 
transistor conducts, and when the incom- 
ing signal is negative only the PNP tran- 
sistor conducts. The two diodes D107 and 
D108 are part of the forward bias network 
consisting of R170 and R172. The two 
diodes allow the bias to be automatically 
adjusting under varying voltage and tem- 
perature conditions. 


5-17 TRANSMITTER CIRCUITS. Q120 


is a parallel mode Colpitts oscillator 
operating in the fundamental mode. Out- 


5-3 


put is multiplied eighteen times before 
reaching the antenna. Output from the 
oscillator is capacitance coupled to mod- 
ulator Q121, and then to the first tripler 
stage, Q122, andtoa bandpass stage 
consisting of L116/C198 and L117, C207, 
C208, C209, C210. A further tripler 
stage, Q123, is followed by bandpass 
coupler L118, C211, L119 and the asso- 
ciated capacitors C214 and C215. The 
bandpass couplers remove unwanted 
harmonics of the crystal oscillator, pass- 
ing only the wanted signal. A doubler 
stage, @Q124, converts the signal to the 
wanted frequency, ready for amplifica- 
tion by amplifiers Q125, Q126, and Q127. 
A double pi output network removes un- 
wanted harmonics from the output signal 
and allows a proper match between tran- 
sistor Q127 and the antenna. 


5-18 All stages following the modulator 
operate approximately class C. In the 
absence of drive these stages draw no 
current. 


5-19 MODULATOR CIRCUITS. In the 
transmit mode, speaker LS1 serves a 
dual function as the microphone. The 
components C171 and R175 form a pre- 
emphasis network. This is followed by 
an audio amplifier Q117 direct coupled to 
a clipper, Q118. Following the clipper 
is a low pass filter comprised of L114, 
C182, R187, and C178, the purpose of 
which is to remove the audio harmonics 
generated in the clipper. The amplifier- 
integrator stage de-emphasizes the sig- 
nal. Output from the integrator on sig- 
nals which have been clipped are triangle 
shaped. These signals are nowfed, 
through the deviation control, to modula- 
tor Q121. The deviation control sets the 
deviation of the modulator. Too great a 
deviation will cause sidebands to fall out- 


side the receiver pass band at the re- 
ceiving end, causing the signal to be very 
distorted. 


5-20 CONTROL CIRCUITS 


5-21 When the push-to-talk switch is de- 
pressed, the following functions take 
place: (1) the antenna is changed from 
the receiver to the transmitter, (2) the 
speaker is removed from the receiver 
and connected to the input of Q117, allow- 
ing its use as a microphone, and (3) the 
+12 volts is removed from the receiver 
and connected to the transmitter. 


5-22 TEST POINTS 


5-23 Various test points have been pro- 
vided in the Model FM-1, and the outputs 
connected to test socket J103. Diode 
D106 rectifies a portion of the oscillator 
voltage, thus the oscillator is merely 
adjusted for maximum dc voltage at the 
test socket, pin 7. Diode D109, likewise, 
feeds a rectified signal to the test socket, 
enabling the various transmitter stages 
to be. tuned for maximum output. A list 
of test points in the instrument is pro- 
vided in Table 5-1. 


5-24 CORRECTIVE MAINTENANCE 


5-25 TROUBLE SHOOTING. In trouble 
shooting the Model FM-1, a step-by-step 
method is helpful. Isolate the fault by 
working back from the speaker until the 
defective stage is found. When trouble 
shooting the receiver it is well to re- 
member that most of the stages are op- 
erated in series for de, in order to keep 
the battery current consumption ata 
minimum. Consequently, a defect in one 
stage may well affect several other 
stages. Voltage measurements should 


Table 5-1. Test Points 


Test 
Point Function 


Transmitter second tripler 
current. 

Transmitter doubler current. 
Receiver discriminator. 
Receiver limiter output. 
Transmitter final drive. 
Receiver oscillator output. 
Battery voltage. 

Receiver audio output. 


Ground. 
Transmitter audio input. 


Transmitter control. 


only be made with a VTVM (except where 


measured at the test socket). The low 
resistance of ordinary multimeters may 
well upset the voltage measurements, 
especially in the higher impedance cir- 
cuits. Tables 5-2 and 5-3 provide a list 
of typical voltage measurements. 


CAUTION 
When aligning the transmitter, it is 
possible to tune some of the cir- 
cuits to the incorrect harmonic. 


5-5 


For example, the first tripler stage 
may also be made to double. An 
absorbsion type wavemeter should 
be used to check the frequency when 
doubt occurs. 


5-26 PARTS REPLACEMENT AND 
ALIGNMENT. When replacing compo- 
nents which are connected to or operate 
in conjunction with one or more of the 
tuned circuits, a realignment of the re- 
paired section should be made. Align- 
ment procedures are fully covered in 
Section III, paragraph 3-15. Every effort 
has been made to use standard compo- 
nents wherever possible to make replace- 
ment of parts noncritical. Components 
are listed by part number and reference 
designation in Section VI of this handbook. 


5-27 When replacing components, care 
should be used not to damage them 
through the use of excessive heat. Al- 
though silicon transistors are used 
throughout, even these can be damaged 
if too much heat is applied for too long a 
period. Likewise, resistors and capaci- 
tors are damaged or change value when 
excessive heat is applied. When replac- 
ing components on the printed circuit 
board, a solder sucker should be used to 
withdraw the solder from eyeletted holes. 


Table 5-2. Receiver Voltage Measurements. 


RF Amp 
lst Mixer 
Oscillator 
2nd Mixer 


With Noise 


dicts i Q107 
2nd IF Q108 
3rd_ IF Q109 
4th IF Q110 
Limiter Q111 


With 0.1 uf from Filter 
Output to Ground 


Q107 
Q108 
Q109 
Q110 
Ql111 


Unsquelched with Noise 


1st Audio Qli2 
Audio Driver Q113 
Audio Out Q114 
Audio Out Q115 
Noise Amp Q116 


Squelched 


Q112 
Q113 
Q114 
Q115 
Q116 


All measurements are referenced to ground. 
Input Voltage: 12 vdc. 
Test Equipment: Hewlett-Packard Model No. 410B VTVM. 


5-6 


Table 5-3. Transmitter Voltage Measurements. 


DC VOLTAGE 


1. Input Voltage: 12 vdc. 
2. Test Equipment: Hewlett Packard Model No. 410B VTVM. 


Sail 


SECTION VI 


PARTS LIST 


6-1 GENERAL 


6-2 This section of the handbook contains 
a list of replaceable parts for the Model 
FM-1 transceiver, and the accessory 
items described in Section VII. The parts 


list is arranged as follows: pages 6-2 
through 6-17 cover the FM-1 unit, pages 
6-18 through 6-20 cover the RP-1 re- 
peater, and the balance of the parts list 
catalogs components of the two-frequency 
kit and the high gain tactical antenna. 


6-1 


CIRCUIT QTY 


REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY 

C101 M1519-01-00084 Capacitor, Dur Mica, J El Menco 
15 pf 

C102 MI519-01-00096 Capacitor, Dur Mica, 1 El Menco 
36 pf 

C103 MI509-01-01019 Capacitor, Disc Ceramic, il Rui MiGs 
0. 001 uf 

C104 MI509-01-01019 Capacitor, Disc Ceramic, 1 iEVey Nike Ge 
0.001 pf 

C105 MI509-02-04001 Capacitor, Tubular Ceramic, il Erie 
il W fort 

C106 MI509-01-01042 Capacitor, Disc Ceramic 1 152, IML, GC 
0.01 uf 

C107 MI509-01-01019 Capacitor, Disc Ceramic il Ie INA. (Ge 
0.001 uf 

C108 MI509-01-01019 Capacitor, Disc Ceramic il IG IML, Ge 
0.001 pf 

C109 MI519-01-00059 Capacitor, Dur Mica, 1 El Menco 
20 pf 

(CULO MI509-02-04001 Capacitor, Tubular Ceramic, 1 Erie 
1.0 pf 

Git MI519-01-00084 Capacitor, Dur Mica, il El Menco 
15 pf 

Ci 

(Cia M1519-01-00084 Capacitor, Dur Mica, il El Menco 
il) yore 

C114 

C115 MI509-01-01019 Capacitor, Disc Ceramic, 1 IR, Mi, C 
0.001 pf 

C116 MI509-01-01042 Capacitor, Disc Ceramic, iL R.M.G. 
0.01 uf 

Cay MI519-01-00023 Capacitor, Dur Mica, il El Menco 
iL [ose 

C118 MI509-01-01043 Capacitor, Disc Ceramic, if Pe. IME, (Cy 
ORI teary, 

(Cie M1519-01-00023 Capacitor, Dur Mica i El Menco 
ik. © Jour 

C120 MI509-01-01042 Capacitor, Disc Ceramic, il Reo Mae 
OA0Lopt 

C121 MI509-01-01042 Capacitor, Disc Ceramic, 1 1, Mi, CG, 
0.01 pf 

C122 MI519-01-00084 Capacitor, Dur Mica, i El Menco 
15 pf 

C123 MI509-01-01042 Capacitor, Disc Ceramic, i IRs Mls (Gg 
0.01 uf 

C124 MI519-01-00023 Capacitor, Dur Mica, iL El Menco 
1.0 pf 5 


6-2 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

C125 

C126 MI519-01-000238 Capacitor, Dur Mica, 1 El Menco 
1 pf 

C127 

C128 

Ci29 

C130 

C1381 MI509-01-01042 Capacitor, Disc Ceramic, 1 R.M.C 
OD, OL pt 

C132 MI509-01-01042 Capacitor, Disc Ceramic, 1 R.M.C 
0.01 yf 

C133 MI509-01-01042 Capacitor, Disc Ceramic, 1 1Bus INL, (C 
0.01 pf 

C134 MI509-01-01042 Capacitor, Disc Ceramic, il R.M.C 
0.01 pf 

C135 MI509-01-01043 Capacitor, Disc Ceramic, il R.M.C 
Oi i 2S y 

C136 MI509-01-01042 Capacitor, Disc Ceramic, il R.M.C 
0.01 pf 

(Cilay MI509-01-01043 Capacitor, Disc Ceramic, 1 R, Mac; 
Oat 2 ony, 

C138 MI509-01-01042 Capacitor, Disc Ceramic, 1 RaMaGs 
0.01 uf 

C139 MI509-01-01043 Capacitor, Disc Ceramic, il Re MiGs 
Oe he? Sav: 

C140 MI509-01-01042 Capacitor, Disc Ceramic, 1 ReaviaGe 
0.01 uf 

C141 MI519-01-00049 Capacitor, Dur Mica, 1 El Menco 
i) jose 

C142 MI519-01-00049 Capacitor, Dur Mica, il El Menco 
12 pf 

C143 MI509-01-01043 Capacitor, Disc Ceramic, 1 R. Macs 
Onl pt 25 Vv 

C144 MI509-01-01019 Capacitor, Disc Ceramic, 1 RE MaG 
0.001 pf 

C145 MI509-01-01042 Capacitor, Disc Ceramic, 1 1365 INAS (Gi, 
0.01 uf 

C146 MI509-01-010438 Capacitor, Disc Ceramic, 1 R.MAG? 
0.1 wi 25 v 

C147 MI509-01-01043 Capacitor, Disc Ceramic, il R. MeiC: 
0.1 pf 25 v 

C148 MI509-01-01042 Capacitor, Disc Ceramic, 1 Ra Vier 
0.01 pf 


eae a ee ae aS eee eT RS Tae Tee Se 
6-3 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

C149 MI509-01-01043 Capacitor, Disc Ceramic, 1 Re Mia Ge 
Om pt 25 v 

C150 MI509-01-01043 Capacitor, Disc Ceramic, il Re MiG: 
1 jut FA) 

Coil MI519-01-00097 Capacitor, Dur Mica, 1 El Menco 
620 pf 

C152 MI519-01-00097 Capacitor, Dur Mica, il El Menco 
620 pf 

C153 MI509-01-010438 Capacitor, Disc Ceramic, 1 R. M. G, 
0.1 uf 25 v 

C154 MI519-02-00069 Capacitor, Dur Mica, 1 El Menco 
820 pf 

Oaliays; MI519-02-00069 Capacitor, Dur Mica, i El Menco 
820 pf 

C156 MI509-01-01020 Capacitor, Disc Ceramic, 1 R. M. CG. 
0.005 uf 

Oley MI528-01-03002 Capacitor, Flat Foil, i Amperex 
0.047 uf 

C158 

C159 MI509-01-01043 Capacitor, Disc Ceramic, iL R.M.C 
Qe tl iit AB 

C160 MI509-01-01043 Capacitor, Disc Ceramic, if: R.M.C 
0.1 pf 25 v 

C161 MI515-02-04012 Capacitor, Electrolytic, 1 Amperex 
4 yufl10v 

C162 K1528-01-03004 Capacitor, Flat Foil, if Amperex 
0.022 uf 

C163 K1515-02-04012 Capacitor, Electrolytic, 1 Amperex 
4pfl10v 

C164 MI509-01-01019 Capacitor, Disc Ceramic, il de VG: 
0.001 pf 

C165 M1509-01-01020 Capacitor, Disc Ceramic, 1 R. M. C 
0.005 uf 

C166 K1515-02-04012 Capacitor, Electrolytic, 1 Amperex 
4 uf10v 

C167 K1515-02-04012 Capacitor, Electrolytic, ~ 1 Amperex 
4 pf 10v 

C168 K1515-02-04015 Capacitor, Electrolytic, 1 Amperex 
40 wi 16 v 

C169 M1509-01-01019 Capacitor, Disc Ceramic, i Tit Wile (ic 
0.001 uf 

C170 K1515-02-04001 Capacitor, Electrolytic, 1 Amperex 
6.4 uf16 v 

enlyal K1528-01-03001 Capacitor, Flat Foil, i Amperex 
0.033 pf 

CLiZ M1509-01-01042 Capacitor, Disc Ceramic, vi iPS, IML, (Cy 
0.01 yf 


6-4 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

C173 M1509-01-01042 Capacitor, Disc Ceramic, 1 ReVEIGe 
0.01 pf 

C174 K1515-02-04014 Capacitor, Electrolytic, il Amperex 
20 pf 16 v 

C175 K1515-02-04016 Capacitor, Electrolytic, 1 Amperex 
80 uf 25 v 

C176 K1515-02-04001 Capacitor, Electrolytic, dl Amperex 
6.4 uf 16 v 

CITT K1515-02-04001 Capacitor, Electrolytic, il Amperex 
6.4 pf 16 v 

Cis M1528-01-03002 Capacitor, Flat Foil, il Amperex 
0.047 uf 

Cuyg M1528-01-030038 Capacitor, Flat Foil, i Amperex 
0.01 pf 

C180 K1515-02-04011 Capacitor, Electrolytic, L Amperex 
50 pi 6.4 v 

C181 K1515-02-04001 Capacitor, Electrolytic, 1 Amperex 
6.4 uf16v 

C182 M1509-01-01042 Capacitor, Disc Ceramic, il Reina 
0.01 pf 

C183 = 

C184 

C185 K1543-01-00001 Capacitor, Variable, il Amperex 
1.5- 8.5 pt 

C186 

C187 M1519-01-00087 Capacitor, Dur Mica, 1 El Menco 
56 pf 

C188 

C189 M1509-01-01042 Capacitor, Disc Ceramic, il Re Wiener 
0.01 pf 

C90 M1519-01-00043 Capacitor, Dur Mica, il El Menco 
100 pf 

Cio M1519-02-00074 Capacitor, Dur Mica, J El Menco 
25 pf 

Cig M1519-01-00050 Capacitor, Dur Mica, 1 El Menco 
22 pf 

(Cie M1519-01-00086 Capacitor, Dur Mica 1 El Menco 
Compl 

C194 M1509-01-01042 Capacitor, Disc Ceramic, iL ReNaGe 
0.01 pf 

C195 M1509-01-01042 Capacitor, Disc Ceramic, 1 R. MEG. 
0.01 uf 

C196 M1519-01-00043 Capacitor, Dur Mica, 1 El Menco 
100 pf 


a Ee ee 
6-5 


SS 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

COT, M1519-02-00034 Capacitor, Dur Mica, il El Menco 
150 pf 

C198 M1519-01-00042 Capacitor, Dur Mica, il El Menco 
47 pf 

C199 M1509-01-01042 Capacitor, Disc Ceramic, il IR, IML, Ge 
0.01 pf 

C200 M1509-01-01042 Capacitor, Disc Ceramic, i IRS IMig Ge 
0.01 pf 

C201 

C202 

C203 

C204 

C205 

C206 M1519-01-00011 Capacitor, Dur Mica, 1 El Menco 
3 pf 

C207 K1543-01-00002 Capacitor, Variable, i Amperex 
2-18 pf 

C208 M1519-02-00076 Capacitor, Dur Mica, 1 El Menco 
27 pf 

C209 K1543-01-00002 Capacitor, Variable, il Amperex 
2-18 pf 

C210 M1519-01-00088 Capacitor, Dur Mica, il El Menco 
82 pf 

C211 M1519-01-00005 Capacitor, Dur Mica, 1 El Menco 
24 pf 

C212 M1509-01-01042 Capacitor, Disc Ceramic, i IR IMI Ge 
0.01 pf 

(CALS M1519-01-00011 Capacitor, Dur Mica, i El Menco 
3 pt 

C214 M1519-02-00076 Capacitor, Dur Mica, il El Menco 
PAL Jovi 

C215 K1543-01-00002 Capacitor, Variable, - 1 Amperex 
2-18 pf 

C216 M1509-01-01042 Capacitor, Disc Ceramic, il It dil (Ge 
0.01 pf 

C217 K1543-01-00002 Capacitor, Variable, 1 Amperex 
2-18 pf 

C218 M1519-02-00064 Capacitor, Dur Mica, 1 E1 Menco 
5 pf 

C219 M1509-01-01042 Capacitor, Disc Ceramic, 1 Hts INiln (Cie 
0.01 pf 

C220 K1543-01-00002 Capacitor, Variable, 1 Amperex 
2-18 pf 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 
C221 
C222 
C223 
C224 K1515-02-04016 Capacitor, Electrolytic, 1 Amperex 
80 pf 25 v 
C225 M1509-01-01019 Capacitor, Disc Ceramic, i| R.M.C. 
0.001 pf 
C226 M1519-02-00064 Capacitor, Dur Mica, 1 El Menco 
5 pf 
C227 M1509-01-01042 Capacitor, Disc Ceramic, 1 ReMi Ge 
0.01 pf 
C228 K1543-01-00002 Capacitor, Variable, 1 Amperex 
2-19 pf 
C229 K1543-01-00002 Capacitor, Variable, 1 Amperex 
2-18 pf 
C230 K1543-01-00002 Capacitor, Variable, 1 Amperex 
2-18 pf 
C23 K1543-01-00002 Capacitor, Variable, 1 Amperex 
2-18 pf 
C232 K1543-01-00001 Capacitor, Variable, il Amperex 
168 2 8 joe 
C233 M1509-01-01042 Capacitor, Disc Ceramic, 1 R.MaGs 
0.01 pf 
C234 M1509-01-01042 Capacitor, Disc Ceramic, 1 IRS IMLS (Ge 
0.01 pf 
€235 
C236 M1509-01-01042 Capacitor, Disc Ceramic, iL RaMa Ge 
0.01 uf 
C237 M1509-01-01042 Capacitor, Disc Ceramic, 1 Re MaGe 
0.01 uf 
C238 
C239 
C240 
D101 AA119 Diode 1 Amperex 
D102 AA119 Diode it Amperex 
D103 1N34A Diode i G.E 
D104 1N34A Diode i G.E 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 

PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

D105 1N34A Diode 1 G.E. 

D106 AAI19 Diode 1 Amperex 
D107 TS4 Diode il Diodes, Inc. 
D108 TS4 Diode 1 Diodes, Inc. 
D109 1N34A Diode 1 G.E. 

D110 

D111 

FL101 K2725-01-00001 Filter, Ceramic TL30D9-57A 1 Clevite 
H101 K2610-01-00001 Heat Sink 1 Wakefield 
H102 K2610-01-00001 Heat Sink 1 Wakefield 
J103 K2129-01-00006 Socket Meter 1 

L101 K1806-01-00070 Coil, Antenna il 

L102 K1806-01-00071 Coil, R.F. Int. 1 

L103 K1806-01-00072 Coil, Mixer Input 1 

L104 K1806-01-00072 Coil, Multiplier Output 1 

L105 K1806-01-00061 Coil, Crystal Trimmer 1 

L106 K1806-01-00074 Coil, Multiplier Output 1 

L107 B1805-02-00205 Coil, IF 1 

L108 B1805-02-00205 Coil, IF 1 

L109 B1805-02-00205 Coil, IF iL 

L110 B1811-02-00029 Coil, IF 1 

L111 M1813-01-00001 XMFR, 455 KC Limiter 1 

L112 M1813-01-00002 Discriminator 455 KC 1 

L113 K5627-01-00010 Choke, Audio 0.5 HY 1 


6-8 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

L114 

L115 K1806-01-00060 Coil, Phase Modulator 1 

L116 K1806-01-00059 Coil, Tripler 1 

L117 K1806-01-00059 Coil, Tripler 1 

L118 K1806-01-00045 Coil, 2nd Tripler 1 

Lal, K1806-01-00045 Coil, 2nd Tripler 1 

L120 M1806-01-00052 Coil, Doubler il 

L121 M1806-01-00053 Coil, Amplifier ih 

L122 M1806-01-00053 Coil, Amplifier 1 

L123 M1806-01-00052 Coil, Amplifier 1 

L124 M1806-01-00054 Coil, Amplifier 1 . 

1125 K1824-02-00002 Coil, OSC Output 1 

L126 K1804-01-00021 Coil, 15 wh 1 

L127 K1804-01-00021 Coil, 15 wh 1 

L128 K1804-01-00021 Coil; 15 fn 1 

L129 K1804-01-00021 Coil, 15 wh i 

L130 K1805-01-00009 Coil, 3.3 uh i 

L131 K1805-01-00009 Coil, 3.3 ph if 

L132 K1805-01-00009 Coilesys ih 1 

L133 K1805-01-00009 Conti, 35 8 ln 1 

1134 K1806-01-00055 Coil, RFC il 

P101 K2132-01-00009 Plug PC Board Output 1 

Q101 2N3478 Transistor, Silicon 1 RCA 

Q102 2N3564 Transistor, Silicon 1 Fairchild 


6-9 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 

PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

Q103 

Q104 2N3564 Transistor, Silicon il Fairchild 
Q105 2N3693 Transistor, Silicon 1 Fairchild 
Q106 

Q107 2N3693 Transistor, Silicon 1 Fairchild 
Q108 2N3693 Transistor, Silicon 1 Fairchild 
Q109 2N3693 Transistor, Silicon 1 Fairchild 
Q110 2N3693 Transistor, Silicon 1 Fairchild 
@iital: 2N3693 Transistor, Silicon il Fairchild 
Q112 2N3693 Tranisistor, Silicon 1 Fairchild 
Q113 2N3567 Transistor, Silicon 1 Fairchild 
Ql14 2N3567 Transistor, Silicon 1 Fairchild 
@15 2N3638 Transistor, Silicon 1 Fairchild 
Q116 2N3693 Transistor, Silicon il Fairchild 
Q117 2N3693 Transistor, Silicon il Fairchild 
Q118 2N3693 Transistor, Silicon 1 Fairchild 
Quy) 2N3567 Transistor, Silicon il Fairchild 
Q120 2N3693 Transistor, Silicon il Fairchild 
Q121 2N3693 Transistor, Silicon i Fairchild 
Q122 2N3693 Transistor, Silicon 1 Fairchild 
Q123 CH2369 Transistor, Silicon il Continental 

Devices 
Q124 CH2369 Transistor, Silicon 1 Continental 
Devices 

Q125 2N3564 Transistor, Silicon 1 Fairchild 
Q126 2N3866 Transistor, Silicon 1 RCA 


6-10 


CIRCUIT QTY 

REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 

ASSY 

PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 

Q127 40280 Transistor, Silicon 1 RCA 
All Resistors Are Fixed Composition 1/4W. +10% Unless Otherwise Specified 

R101 4K702-01-00047 Resistor, 18K i Moulded Ntl. 
R102 K4702-01-00044 Resistor, 10K 1 Moulded Ntl. 
R103 K4702-01-00028 Resistor, 470 Ohm i Moulded Ntl. 
R104 K4702-01-00028 Resistor, 470 Ohm 1 Moulded Ntl. 
R105 K4702-01-00052 Resistor, 47K il Moulded Ntl. 
R106 K4702-01-00049 Resistor, 27K 1 Moulded Ntl. 
R107 K4702-01-00038 Resistor, 470 Ohm BD Moulded Ntl. 
R108 K4702-01-00036 Resistor, 2.2K il Moulded Ntl. 
R109 . 
R110 K4702-01-00048 Resistor, 22K dl Moulded Ntl. 
jee eilal K4702-01-00056 Resistor, 100K a Moulded Ntl. 
R112 K4702-01-00052 Resistor, 47K i Moulded Ntl. 
R113 K4702-01-00024 Resistor, 220 Ohm if Moulded Ntl. 
R114 K4702-01-00038 Resistor, 3.3K il Moulded Ntl. 
R115 K4702-01-00050 Resistor, 33K if Moulded Ntl. 
R116 
R117 K4702-01-00037 Resistor, 2.7K Ak Moulded Ntl. 
R118 K4702-01-00051 Resistor, 39K 1 Moulded Ntl. 
R119 K4702-01-00049 Resistor, 27K 1 Moulded Ntl. 
R120 K4702-01-00032 Resistor, 1K il Moulded Ntl. 
R121 
R122 
R123 


6-11 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER 


ASSY 


MANUFACTURER 


PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 


R124 


R125 


R126 


R127 


R128 


R129 


R130 


R131 


R132 


R133 


R134 


R135 


R136 


R137 


R138 


R139 


R140 


R141 


R142 


R143 


R144 


R145 


R146 


R147 


K4702-01-00032 


K4702-01-00032 


K4702-01-00032 


K4702-01-00056 


K4702-01-00038 


K4702-01-00056 


K4702-01-00038 


K4702-01-00056 


K4702-01-00038 


K4702-01-00056 


K4702-01-00038 


K4702-01-00032 


K4702-01-00056 


K4702-01-00044 


K4702-01-00032 


K4702-01-00028 


K4702-01-00032 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 470 Ohm 


Resistor, 


1K 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


CIRCUIT 
REFERENCE 


PART NO. 


DESCRIPTION 


PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 


R148 


R149 


R150 


R151 


R152 


R153 


R154 


R155 


R156 


R157 


R158 


R159 


R160 


R161 


R162 


R163 


R164 


R165 


R166 


R167 


R168 


R169 


R170 


R171 


K4702-01-00046 


K4702-01-00046 


K4702-01-00037 


K4702-01-00058 


K4702-01-00056 


K4702-01-00050 


K4702-01-00032 


K4702-01-00041 


K4702-01-00032 


K4702-01-00056 


K4702-01-00046 


K4702-01-00020 


K4702-01-00036 


Resistor, 15K 


Resistor, 15K 


Resistor, 2.7K 


Resistor, 150K 


Resistor, 100K 


Resistor, 33K 


Resistor, 1K 


Resistor, 5.6K 


Resistor, 1K 


Resistor, 100K 


Resistor, 15K 


Resistor, 100 Ohm 


Resistor, 2.2K 


MANUFACTURER 


Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 
- 

Moulded Ntl. 

Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


CIRCUIT 
REFERENCE 


PART NO. 


DESCRIPTION 


MANUFACTURER 


PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 


R172 


R173 


R174 


R175 


R176 


Raid 


R178 


R179 


R180 


R181 


R182 


R183 


R184 


R185 


R186 


R187 


R188 


R189 


R190 


R191 


R192 


R198 


R194 


R195 


6-14 


K4702-01-00036 


K4702-01-00041 


K4702-01-00032 


K4702-01-00042 


K4702-01-00035 


K4702-01-00044 


K4702-01-00038 


K4702-01-00039 


K4702-01-00032 


K4702-01-00039 


K4702-01-00052 


K4702-01-00041 


K4702-01-00020 


K4734-01-00010 


K4702-01-00056 


K4702-01-00036 


K4702-01-00056 


K4702-01-00041 


Resistor, 2.2K 


Resistor, 5.6K 


Resistor, 1K 


Resistor, 6.8K 


Resistor, 1.8K 


Resistor, 10K 


Resistor, 3.3K 


Resistor, 3.9K 


Resistor, 1K 


Resistor, 3.9K 


Resistor, 47K 


Resistor, 5.6K 


Resistor, 100 Ohm 


Resistor, Variable 2K 


Resistor, 100K 


Resistor, 2.2K 


Resistor, 100K 


Resistor, 5.6K 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Amperex 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 
R196 K4702-01-00030 Resistor, 680 Ohm il Moulded Ntl. 
R197 K4702-01-00036 Resistor, 2.2K 1 Moulded Ntl. 
R198 K4702-01-00016 Resistor, 47 Ohm 1 Moulded Ntl. 
R199 K4702-01-00036 Resistor, 22K i Moulded Ntl. 
R200 K4702-01-00026 Resistor, 330 Ohm 1 Moulded Ntl. 
R201 K4702-01-00024 Resistor, 220 Ohm 1 Moulded Ntl. 
R202 K4702-01-00056 Resistor, 100K i! Moulded Ntl. 
R203 K4702-01-00008 Resistor, 10 Ohm il Moulded Ntl. 
R204 
R205 
R206 K4702-01-00020 Resistor, 100 Ohm 1 Moulded Ntl. 
R207 K4702-01-00008 Resistor, 10 Ohm il Moulded Ntl. 
s 

R208 K4702-01-00056 Resistor, 100K 1 Moulded Ntl. 
R209 K4702-01-00028 Resistor, 470 Ohm 1 Moulded Ntl. 
X101 K2116-01-00002 Socket, Crystal 1 
X102 K2116-01-00002 Socket, Crystal 1 
X103 K2116-01-00002 ‘Socket, Crystal 1 
X104 K2116-01-00002 Socket, Crystal 1 
X105 K2116-01-00002 Socket, Crystal il 
X106 K2116-01-00002 Socket, Crystal ul 
Y101 K2305-01-00089 Crystal, Receiver 1 
Y102 K2304-01-00024 Crystal, Transmitter 1 

PL9016-02-00008 Printed Circuit Board 1 

Assembly 
1730-01-00003 Printed Circuit Board il 


6-15 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 
M2873-50-00501 Screw, Nylon 12 
No. 6-32 x 1/4 LG 
M2898-63-31005 Lockwasher, Int Tooth 1 
K1435-02-00052 Shield, RF 1 
Alignment Tool 1 
K2884-63-00009 Standoff, (for alignment il 
tool) 
K5136-01-00006 Clip, (for alignement tool) 1 
K2806-51-04216 Screw, BD HD iI 
No. 4-40 x 1/2 LG 
M2893-51-04204 Nut, No. 4-40 3} 
M2898-63-41002 Lockwasher 2 
M2884-63-00003 Standoff Ge 
M2806-51-04228 Screw, DB HD w 
No. 4-40 x 7/8 LG 
K3135-01-00200 Tubing, 14-inches iL 
K6003-01-00004 Wire, Bare 1 
No. 20 AWG, 12-inches 
TRAY ASSEMBLY 
D1 K482 4-01-00001 Diode, 1N91 1 G.E. 
J1 K212 1-01-00001 Socket, Male (Ext. Bat) il Switchcraft 
J2 K2109-01-00013 Jack, Phone (Min. ) 1 Switchcraft 
J3 K2111-01-00004 Socket, Coaxial il Dage 
LS1 K1310-01-00014 Speaker, 32 Ohms 1 Oaktron 
R1 K4735-01-00621 Resistor, Variable, 10K o 1 
R2 K4735-01-00620 Resistor, Variable, 10K 1 
R3 K4702-01-00024 Resistor, 1/4W + 10%, 1 Moulded Ntl. 
220 Ohms 
R4 K4702-01-00041 Resistor, 1/4W + 10%, 1 Moulded Ntl. 
5.6K 
$1 K5125-01-00001 Switch, 4PDT 1 Moulded Ntl. 


PL9016-02-00012 


Tray Assembly 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
TRAY ASSEMBLY (Cont'd) 
PL9016-03-00018 Control Plate Assembly 1 
PL9016-03-00017 Fuse Block Assembly il 
PL9016-03-00019 Chassis Assembly i 
K2137-01-00005 Cap & Chain it Amphenol 
K2806-51-04114 Screw, BD. HD. 2 
No. 4-40 x 7/16 LG 
M2893-51-04101 Hex Nut, No. 4-40 7 
M2898-63-36002 Lockwasher No. 4 2 
Int. Tooth 
M2888-26-12023 Terminal Lug il 
M2892-67-12101 Rivet, 3/8 LG iL 
K3135-01-05200 Sleeving, No.8, 1 
1-1/8 LG 
K2430-02-00111 Knob, Volume Control 1 
K2827-67-04104 Set Screw, No. 4-40 1 
ed 
K2137-02-00009 Dummy Connector 1 
K2806-51-08116 Screw, BD. HD. 1 
No. 8-32 x 1/2 LG 
M2893-51-25201 Nut, Hex, 1/4 x 32 x 1/16 2 
THK. 
M2893-51-17202 Nut, Hex, 3/8 x 32 x 1/16 1 
THK. 
M2898-63-36005 Lockwasher, Int. Tooth 2 
K2537-02-00043 Spring, Speaker Mtg. 1 
K1450-02-00220 Bracket, Switch Mtg. 1 
K2806-51-04104 Screw, BD. HD. il 
No. 4-40 x 1/8 LG 
K3123-01-00041 Ring, Speaker Protect 1 
K2418-02-00053 Label, Battery Polarity 1 
B2418-02-00052 Label, Tuning Inst. (English) 1 


CIRCUIT QTY 
REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
REPEATER PRINTED CIRCUIT BOARD ASSEMBLY 

C501 M1509-01-01019 Capacitor, Disc Ceramic 1 IRS Ils (Ce 
0.001 uf 

C502 M1528-01-03002 Capacitor, Flat Foil, i Amperex 
0.047 uf 

C503 M1509-01-01042 Capacitor, Disc Ceramic, al IRs IMI, (Ge 
0.01 uf 

C504 M1509-01-01042 Capacitor, Disc Ceramic, 1 Its IM (ic 
0201 pie 25.v 

C505 M1509-01-01042 Capacitor, Disc Ceramic, 1 1s INibs (Ge 
0.01 uf 25 v 

C506 M1509-01-01043 Capacitor, Disc Ceramic, 1 IR IMIS (Cie 
Ok, al punt Sy 

C507 M1509-01-01043 Capacitor, Disc Ceramic, 1 IBYs Ils Ge 
O. a pp Bw 

C508 M1509-01-01043 Capacitor, Disc Ceramic, 1 Its IMIS Go 
(5 al ene 45) 4y 

C509 B1515-02-04012 Capacitor, Electrolytic, 1 Amperex 
4A wt 

C510 B1515-02-04012 Capacitor, Electrolytic, il Amperex 
4 pt 

C511 B1515-02-04012 Capacitor, Electrolytic, 1 Amperex 
4 ut 

Con? B1515-02-04012 Capacitor, Electrolytic, if Amperex 
4 uf 

C513 B1515-02-04017 Capacitor, Electrolytic, 1 Amperex 
250 pf 

C5i5 M1509-01-01042 Capacitor, Disc Ceramic, il IRG Ml, Ge 
0.01 pf 

D501 M4805-02-00102 Diode, TS4 il Diodes, Inc. 

D502 M4805-02-00102 Diode, TS4 1 Diodes, Inc. 

D503 M4805-02-00102 Diode, TS4 1 Diodes, Inc. 

D504 M4805-02-00102 Diode, TS4 iL Diodes, Inc. 

J501 K2124-01-00001 Socket, Relay i P & Brumfield 

L501 1802-02-00051 RF Choke, 2.5 wh 1 P & Brumfield 

Q501 K4857-01-00002 Transistor, 2N3693 1 Fairchild 

Q502 K4857-01-00002 Transistor, 2N3693 it Fairchild 

Q503 K4857-01-00002 Transistor, 2N3693 i Fairchild 

Q504 K4849-01-00001 Transistor, 2N3638 al Fairchild 


CIRCUIT QTY 


REFERENCE PART NO. DESCRIPTION PER MANUFACTURER 
ASSY 
REPEATER PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 
Q505 4840-01-00001 Unijunction Transistor, a G.E. 
2N1671 
Q506 4816-01-00001 Silicon Controlled Rect. a G.E. 
C6U 
Q507 K4857-01-00002 Transistor, 2N3693 1 Fairchild 
Q508 K4859-01-00001 Transistor, 2N3567 ft Fairchild 
Resistors Are 1/4 Watt + 10% Unless Otherwise Specified. 
R501 K4734-01-00012 Resistor, Variable, i Amperex 
10K Gain 
R502 K4702-01-00037 Resistor, 2.7K if Moulded Ntl. 
R503 K4734-01-00012 Resistor, Variable, 1 Amperex 
LOK Rip 
R504 K4702-01-00040 Resistor, 4.7K 1 Moulded Ntl. 
R505 K4702-01-00050 Resistor, 33K 1 Moulded Ntl. 
R506 K4702-01-00028 Resistor, 470 Ohms 1 Moulded Ntl. 
R507 K4702-01-00041 Resistor, 5.6K 1 Moulded Ntl. 
= 
R508 K4702-01-00050 Resistor, 33K 1 Moulded Ntl. 
R509 K4702-01-00046 Resistor, 15K il Moulded Ntl. 
R510 K4702-02-00160 Resistor, + 5% 3.6K 1 Moulded Ntl. 
R511 K4702-01-00042 Resistor, 6.8K Al Moulded Ntl. 
R512 K4702-01-00036 Resistor, 2.2K ik Moulded Ntl. 
R513 K4702-01-00044 Resistor, 10K 1 Moulded Ntl. 
R514 K4702-01-00047 Resistor, 18K 1 Moulded Ntl. 
R515 K4702-02-00192 Resistor, + 5% 75K 1 Moulded Ntl. 
R516 K4702-01-00062 Resistor, 330K 1 Moulded Ntl. 
R517 K4702-01-00033 Resistor, 1.2K 1 Moulded nae 
R518 K4702-01-00032 Resistor, 1K af Moulded Ntl. 
R519 K4702-01-00036 Resistor, 2.2K 1 Moulded Ntl. 


6-19 


CIRCUIT 
REFERENCE 


PART NO. 


DESCRIPTION 


REPEATER PRINTED CIRCUIT BOARD ASSEMBLY (Cont'd) 


eR ———————————— 


R520 


R521 


R522 


R523 


R524 


R525 


R526 


R527 


R528 


R529 


R531 


K4702-01-00034 


K4702-01-00046 


K4702-01-00036 


K4734-01-00011 


K4702-01-00058 


K4702-01-00023 


K4702-01-00023 


K4702-01-00024 


K4702-01-00032 


K4702-01-00032 


K4702-01-00032 


1450-01-00238 


1730-01-00004 


9016-02-00017 
9016-02-00018 
1509-01-01042 
1509-01-01042 
1543-01-00001 
4802-01-00001 
4802-01-00001 
4802-01-00001 
4802-01-00001 
1806-01-00061 
4702-01-00044 
4702-01-00044 
4702-01-00044 
4702-01-00044 
5101-01-00012 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


Resistor, 


1.5K 


15K 


2.2K 


Variable, 200K 


150K 


180 Ohms 


180 Ohms 


220 Ohms 


1K Ohms 


1K Ohms 


1K Ohms 


Bracket, Relay 


Printed Circuit Board 


TWO FREQUENCY KITS 


P. C. Board Assem,. Rec. 
P.C. Board Assem. Trans. 
Capacitor .0I1MFD Disc. 
Capacitor .01MFD Disc. 
Capacitor Variable 2-18PF 
Diode IN456 

Diode IN456 

Diode IN456 

Diode IN456 

Coil Freq. Adjust J 
Resistor 10K 

Resistor 10K 

Resistor 10K 

Resistor 10K 

Switch SPST 


= =| = =] SoS Se SS SS Se Se eS eS Se Ee 


MANUFACTURER 


Moulded Ntl. 


Moulded Ntl. 
Moulded Ntl. 
Amperex 

Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


Moulded Ntl. 


RM. 'G. 

Re Mac, 
Amperex 
Sylvania 
Sylvania 
Sylvania 
Sylvania 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
Moulded Ntl. 
ALCO 


6-20 


SECTION VII 


INSTALLATION, OPERATION, AND 
MAINTENANCE INSTRUCTIONS - 
ACCESSORY ITEMS 


7-1 GENERAL 


7-2 This section of the handbook pro- 
vides instructions for installing, op- 
erating, and maintaining three accessory 
items used with the FM-1 transceiver. 
These are: the two-frequency conversion 
kit, the RP-1 back-to-back one-way 
repeater, and the high gain tactical an- 
tenna. The two-frequency conversion kit 
permits the instrument to operate on two 
separate frequencies. The RP-1 repeater 
is designed to increase the normal com- 
munication distance of the FM-1. The 
high gain tactical antenna increases the 
low-angle transmitted energy of the unit. 


7-3 Paragraphs 7-4 through 7-13 de- 
scribe installation, operation, and main- 
tenance of the two-frequency conversion 
kit. The RP-1 repeater is covered in 
paragraphs 7-14 through 7-25, and the 
description of the tactical antenna starts 
at paragraph 7-26. 


7-4 TWO-FREQUENCY CONVERSION 
KIT 


7-5 DESCRIPTION. The two-frequency 
conversion kit (Figure 7-1) consists 
primarily of twodiode switching networks 
actuated from a front panel switch. The 
networks are built upon two small printed 
circuit boards (PC601 and PC602) which 
are plugged into receiver and transmitter 
crystal sockets X101, X102, X104 and 
X105. An extra pin at each socket allows 
a third connection to each board (Sockets 


X103 and X106) (see Figure 3-1). In the 
case of the receiver plug-in module, to 
fit the module to the transceiver printed 
circuit board it is only necessary to re- 
move the crystal and plug the PC601 
module into the FM-1 printed circuit 
board. The pin spacing is so arranged 
that the module faces inward. The 
module is fitted with two crystals. In- 
ductor L20 on the module is used to 
"pull" the frequency of crystal Y101B, and 
inductor L105, on the FM-1 printed cir- 
cuit board, is retained in circuit andused 
to "pull'' the second crystal, Y1O1A. To 
install the transmitter two-frequency 
conversion module it is necessary to cut 
or remove the jumper wire connected 
between X105 and X106 adjacent to the 
transmitter crystal sockets on the FM-1 
printed circuit board. The jumper is of 
plain wire on the top side of the board 
(see Figure 3-1). The two-frequency 
module is plugged-in inplace of the crys- 
tal. A third pin, X106, indexes the mod- 
ule so that the components face inward. 


7-6 Capacitor C31 on the module is 
used to "pull" crystal Y101B,and capacitor 
C185 on the FM-1 printed circuit board 
is used to "pull" the second crystal. 


7-7 INSTALLATION OF TWO-FRE- 
QUENCY SWITCH. After the two modules 
are in place it is necessary to drill an 
0.25-inch hole in the FM-1 front panel. 
A template is provided as part of the kit 
in order that the hole may be properly 
located. The template is placed over the 


CAL 


RECEIVE 


Figure 7-1 
SEE S$ 


panel and a centering hole made with a 
center punch. The panel is then drilled. 
The red wire from switch S30 is con- 
nected to the +12 volts on the transceiver 
side of the ON/OFF switch which is on 
volume control Rl. The FM-1 is now 
ready for alignment and operation. 


7-8 ALIGNMENT OF TWO-FREQUENCY 
KIT. Alignment of the two-frequency kit 
is carried out as described in Section II, 
paragraph 3-15. The frequency switch is 
placedin one position and the appropriate 
crystals are aligned to frequency. The 
switch is then placed at the other fre- 
quency and the other set of crystals 
aligned to frequency. 


7-9 OPERATION LIMITATIONS OF 


TWO-FREQUENCY KIT. Because of the 
high degree of selectivity obtained in the 


7-2 


TRANSMIT 


. Two-Frequency Conversion Kit. 
{ FOR SCHEMATIC DIAGRAM 


FM-1 receiver and transmitter circuits, 
it is necessary to choose frequencies as 
close as possible to each other. The 
closer the frequencies the better will be 
the sensitivity of the receivers and the 
higher the transmitter output powers. A 
frequency separation of 600 kc must be 
considered maximum. Sensitivity and 
power output may be equalized by adjust- 
ing the receiver and transmitter tuned 
circuits to a position midway between 
each frequency. This is especially so 
when the separation is greater. 


7-10 OPERATING PRINCIPLES FOR 
TWO-FREQUENCY KIT. The schematic 
diagram for the two-frequency circuit is 
illustrated in Figure|8-1. When frequency 
selector switch S30 is inthe right-hand 
position, a positive voltage is applied to 
the anode of D20. Because the cathode 


of the diode is connected to ground through 
L105 when the module is installed, the 
diode is able to conduct and is therefore 
in the ON position. Thus, crystal YIO1A 
is connected from the base of Q104, 
through the link winding on L125 to diode 
D601 and through L105 to ground. This 
is a normal oscillating position. 


7-11 Meanwhile, diode D21, because it 
is without positive voltage is not conduct- 
ing and is OFF, and crystal Y10IBis un- 
able to operate. When the switch is 
thrown to the left-hand position the oppo- 
site condition occurs. D21 is ON and 
D20 is OFF. Y101Ais not operating and 
Y10 IBis oscillating. 


7-12 When the switch is in the right- 
hand position, positive voltage is applied 
to diode D32 in the transmitter section 
causing it to conduct. It is now in the ON 
position. In effect, crystal Y102Bis con- 
nected from the base of Q120 through 
diode D32 to ground. This is a normal 
oscillating condition. Meanwhile because 
D31 is without positive voltage it re- 
mains OFF and Y102A is inactive. When 
the switch is placed in the left-hand posi- 
tion, the opposite condition occurs; D31 
is ON and D32 is OFF, Y102B is not op- 
erating and Y102Ais oscillating. 


7-13 MAINTENANCE OF TWO-FRE- 
QUENCY KIT. Maintenance of the two- 
frequency kit consists of a VTVM check 
to assure proper functioning. This is ac- 
complished by the following measure- 
ments: when a diode is ON a forward 
biased voltage across the diode will nor- 
mally be approximately 0.6 volts; when 
the diode is in the OFF condition no volt- 
age will be across the diode. 


7-14 RP-1 BACK-TO-BACK ONE-WAY 
REPEATER 


7-15 DESCRIPTION. The RP-1 repeater 
(Figure 7-2) is designed to increase the 
normal operating communication distance 
of the FM-1, FM-5and similar FM equip- 
The system is built around two 
FM-1 transceivers, one of which is used 
to receive a signal from point A and re- 
transmit the signal through a second 
FM-1 to point B. When point A has com- 
pleted transmission, point B may reply, 
the signal being repeated in the same 
manner. (See Figure 7-3). In operation, 
No. 1 FM-1 receives the signal from 
point A at one frequency (example 150 
mc). The signal is then fed via the re- 
peater to No.2 FM-1 and retransmitted 
at a different frequency (example 170 mc) 
to point B. When point B replies the sig- 
nal is received by No. 1 FM-1 and re- 
transmitted by No. 2 FM-1 to point A. In 
this example: The receiver at point A 
would be tuned to 170 mc. The receiver 
at point B would be tuned to 170 me. The 
transmitter at point A would be tuned to 
150 me. The transmitter at point Bwould 
be tuned to 150 mc. No. 1 FM-1 would 
receive only. No. 2 FM-1 would transmit 
only. 


ment. 


7-16 From the moment a Signal is re- 
ceived by the No. 1 FM-1, a timer is 
actuated in the repeater which causes No. 
2 FM-1 to switch off after a period of 3 
minutes has elapsed. This circuit pre- 
vents a transmitter that has been acci- 
dentally left on or an interferring carrier 
from holding the repeater in the transmit 
condition. However, when a carrier is 
removed before the 3 minutes has 
elapsed, the repeater immediately goes 
back to the receive condition and the 
timer resets to zero. 


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1 Repeater Functional Block Diagram. 


Si al ew 


Figure 7 


7-17 INSTALLATION OF RP-1 RE- 
PEATER. To operate the two FM-1 
transceivers in conjunction with the re- 
peater it is necessary to make modifica- 
tions to both FM-1 units. A special kit 
is supplied with the repeater kit to make 
this conversion. When unpacking the 
RP-1 repeater equipment, check that the 
equipment is undamaged and complete. 
The kit consists of the following: 


1. The RP-1 repeater together with 
the attached three-foot lengths of 
cables complete with plugs. 


2. No. 2 FM-1 adaptor. 
3. Cover plate and screws (two sets). 


4. For each ten repeaters, one con- 
version kit consisting of template 
and punch. 


7-18 The two FM-1 units are modified 
as follows: 


1. Remove cases from both FM-1 
units. 


2. Place thetemplate over the mouth- 
piece and drill a 3/8-inch diameter 
hole at the point indicated on the 
template. The hole will be below 
the mouthpiece and immediately 
over the test socket of the printed 
circuit board. 


3. Using the punch supplied with the 
conversion kit, punch out a hole 
using the 3/8-inch hole as a guide. 


4. Place the template back over the 
mouthpiece and drill two 1/16- 
inch diameter holes at the points 
indicated. These holes are used 


1-6 


to hold the cover when the FM-1 
is not being used as a repeater. 
Two thread-cutting screws are 
provided with the kit for this pur- 
pose. 


5. Let one FM-1 transceiver be No. 2 
FM-1 (transmitter). At the top 
end of the No. 2 FM-1 remove 
P101 from socket J4. P101 is the 
plug at the end of the printed cir- 
cuit board cable which plugs into 
the socket on the chassis proper. 


6. Insert the adaptor plug provided in 
the conversion kit in series with 
plug P101 and socket J4. This 
adaptor disconnects the antenna 
from the push-to-talk switch and 
connects it permanently to the 
transmitter output. At the same 
time, the +12 volt supply is dis- 
connected from the receiver. The 
transmitter +12 volt line is then 
connected to the test socket. The 
FM-1 units are now ready for con- 
nection to the repeater. 


7-19 BATTERY INSTALLATION IN RP-1 
REPEATER. Only one battery is nec- 
essary to operate the FM-1, the No. 2 
FM-1, and the repeater. The battery is 
connected to the No. 1 FM-1. Either the 
internal or an external battery may be 
used. However, the external battery is 
preferable in view of the extra drain of 
the repeater unit. Connect batteries to 
No. 1 FM-1. Connect the repeater cables 
to the test sockets through the punched 
holes in the cases of the two FM-1 units. 
The cable marked "Input From Receiver" 
connects to the No. 1 FM-1 and the cable 
marked ''Output To Transmitter'' connects 
to the No. 2 FM-2. It is important that 
the correct cable terminations be ob- 


served. At the plug end of the cable 
marked "Input From Receiver" will be 
founda small single connection plug P502. 
This plug must be connected into the 
small pin jack (J105) on the printed cir- 
cuit board also accessible through the 
punched hole in the case of No. 1 FM-1. 
No. 1 FM-1 is operated in the receive 
mode only. The transmitter portion of 
this unit is unused. The receiver portion 
should be as far removed in frequency as 
possible from the transmitter of No. 2 
FM-1. The receiver portion of No. 2 
FM-1 is not used. Frequency separation 
of the two units should be at least 10 mc. 
The closer the spacing of the two fre- 
quencies the further should be the spacing 
of the two antennas. 


7-20 ANTENNA INSTALLATION FOR 
RP-1 REPEATER. The importance of 
obtaining good isolation between the two 
antennas cannot be too heavily stressed. 
For best operation the two antennas 
should be at least 20 feet apart. In some 
cases the ground plane antenna may be 
mounted above the other antenna and the 
ground plane usedas a shield between the 
two dipoles. If feedback occurs between 
the two transceivers, indicated by squeal- 
ing noises from the receiver or, in 
severe cases, by chattering of the relay 
in the repeater unit, or perhaps lock-up 
of the transmitter, it is often possible to 
clear this by moving one antenna further 
away from the other. A good method for 
checking this condition is to open the 
squelch of the No. 1 FM-1. Pull plug 
P502 from J105 in the No. 1 FM-1. This 
will turn on the No. 2 FM-1. If a change 
occurs in the hiss level from the No. 1 
FM-1, RF energy from the No. 2 FM-1 
is getting into the front end of the No. 1 
receiver. The condition can be rectified 
only byfurther separation of the antennas 


or a further separation in frequency. If 
the hiss level is reduced by the No. 2 
FM-1 transmitter, the repeater may not 
shut off when the incoming signal goes off. 


7-21 CONTROL ADJUSTMENTS FOR 
RP-1 REPEATER. After the repeater is 
connected to the FM-1 transceivers as 
described above, turn Trip Level Control 
R503 counterclockwise until the relay 
closes. Move back on the control until 
the relay opens. This is the correct set- 
ting. Time control R523 controls the 
time it takes for the relay to open again 
after having been closed by an incoming 
signal, oralternatively, by rotation of Level 
Control R503. Audio Gain Control R501 
is adjusted until proper deviation is ob- 
tained from the No. 2 FM-2. The mea- 
surement is best made with the aid of a 
modulation monitor. 


7-22 SUCCESSFUL REPEATER OPERA- 
TION. In order to successfully repeat the 
signal from A to B or from B to A it*is 
necessary for the following conditions to 
exist: 


1. Transceiver No. 1 FM-1 must re- 
ceive a good signal from point A 
OGL Be 


2. Point A or B must receive a good 
signal from No. 2 FM-1._ The 
repeater cannot improve a poor 
signal-to-noise received at No. 1 
FM-1. 


3. The antenna connected to No. 1 
FM-1 must be as far removed as 
possible from that of No. 2 FM-1. 
Preferably No.1 FM-1 shouldbe at 
one endof the frequency range cov- 
ered by the FM-1 and FM-5 equip- 
ments and No.2 FM-1at the other. 


(Et 


SBE SCHEMATIC DIAGRAM ¥-4 

7-23 THEORY OF OPERATION FOR 
RP-1 REPEATER. The presence of a 
signal in an FM receiver using full limit- 
ing will cause a reduction in the noise 
output of the discriminator. This change 
in noise level, besides being used to op- 
erate a receiver squelch is also used to 
automatically operate a repeater unit. 
The RP-1 repeater unit obtains its noise 
voltage via a cable from the receiver 
portion of the No. 1 FM-1. The noise 
voltage is amplified by transistors Q501 
and Q502. The amplitude of the input 
signal level is controlled by potentiom- 
eter R503. Diodes D501 and D502 rectify 
the noise produced by Q502. The negative 
going dc voltage is then applied to the 
base of de amplifier Q503, causing this 
stage to be cut off and the collector volt- 
age almostat the supply voltage potential. 
This high positive voltage is now applied 
to the base of PNP amplifier Q504 which 
causes this stage also to be cut off and 
the relay to open. The three other stages 
are inoperative. When a signal causes 
the noise output from Q502 to fall, the dc 
output from D501 and D502 also falls, and 
transistors Q503 and Q504 conduct. Bias 
voltage is applied to the base of Q503 via 
R520, Q508 conductérs and the relay 
closes. This applies +12 volts to the 
No. 2 FM-1, allowing the transmitter 
portion of this unit to operate. The audio 


7-8 


signal from the No. 1 FM-1 is conducted 
via the cables and the audio gain control 
R501 to the No. 2 FM-1. When Q504 
caused the relay to close, diode gate 
D504, which had previously been closed, 
now opens and capacitor C513 begins to 
discharge through R524 and R523. 


7-24 The values of C513 and resistors 
R524 and R523 are selected so that at the 
end of three minutes the voltage across 
the capacitor has fallen to a value suffi- 
cient to cause unijunction transistor Q505 
to fire, causing a sharp spike to be 
applied to the silicon-controlled rectifier 
Q506. Q506 also fires, Q507 conducts, 
the bias is removed from Q508 because 
Q507 is now saturated and the relay 
opens, restoring the FM-1 transceivers 
to their normal standby position. If the 
signal is removed before the three min- 
utes are up, the relay opens andthe FM-1 
transceivers revert tothe normal standby 
position. 


7-25 MAINTENANCE OF THE RP-1 
REPEATER. Corrective maintenance 
involves two basic requirements: local- 
ization of trouble and its isolation. The 
localization of trouble is most easily ob- 
tained by making use of the voltage 
charts. A complete voltage chart is pro- 
vided in Table 7-1. 


Table 7-1. Voltage Chart For RP-1 Repeater. 


N3693 
N3693 
N3693 
N3683 


Noise Amp. 
Noise Amp. 
DC Amp 

Switch 


mow WS bw 


2N1671 | Timer 


S.C. R. Switch 
S.C. R. Switch 
DC Amp 
DC Amp 
Switch 


GEC6U 
GEC6U 
2N3693 
2N3693 
2N3567 


@ Time = 0 Value. Exponential Delay of Voltage at This Point. 
® After Time Out and Q506 (SCR) Fired. 
Measurements Made with VOM, 0 - 50 wamp. 


(eo) 


SECTION VIII 


SCHEMATIC DIAGRAMS 


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— 


8-2 


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